HMC132C8 Datasheet, PDF (3/6 Pages) Hittite Microwave Corporation – GaAS MMIC SMT HIGH-ISOLATION SPDT SWITCH DC - 8 GHZ

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MICROWAVE CORPORATION
HMC132C8
HMC132C8 SMT HIGH-ISOLATION SPDT SWITCH DC - 8 GHZ
FEBRUARY 2001
Schematic
RF COM
(PIN 7)
RF1
PIN 1)
RF2
(PIN 4)
A
B
(PIN 5) (PIN 6)
(PINS 2,3,8 and
BACKSIDE are GND)
Absolute Maximum Ratings
Control Voltage Range
Storage Temperature
Operating Temperature
+0.5 to -7.5 Vdc
-65 to +175 deg C
-55 to +85 deg C
Truth Table
Control Input
A
B
High
Low
Low
High
Signal Path State
RF to RF1
RF to RF2
ON
OFF
OFF
ON
Do not "HOT" switch power levels > +15 dBm ( V_ctl = 0/-5Vdc)
Control Voltages
State
Low
High
Bias Condition
0 to -0.2V @ 20uA Max.
-5V@200uA Typ to -7V@600uA Max
7 ^Outline
PIN 8
CHAMFERED
0.197/0.203
(5.00/5.16)
RF
GND COM B A
0.004 (0.10)
COPLANARITY
MAX.
0.095
(2.41)
MAX.
0 DEG.
TO 7 DEG.
0.282/0.298
(7.16/7.57)
HMC
132C8
0.157/0.163
(3.99/4.14)
0.020/0.040
(0.51/1.02)
PIN 1
RF1 GND GND RF2
0.007/0.009 TYP
(0.18/0.23)
0.177/0.183
(0.18/0.23)
0.050 TYP
(1.27)
0.137/0.143
(3.48/3.63)
RF GND PLANE
COPLANAR WITH LEADS
0.020 +/- 0.003 TYP
(0.51 +/- 0.08)
1. MATERIAL:
A) PACKAGE BODY & COVER : WHITE ALUMINA (92%)
B) LEADS & PACKAGE BOTTOM: COPPER
2 . PLATING : ELECTROLYTIC GOLD 100 - 200 MICROINCHES
OVER ELECTROLYTIC NICKEL 100 TO 200 MICROINCHES.
3. DIMENSIONS ARE IN INCHES (MILLIMETERS).
UNLESS OTHERWISE SPECIFIED TOL. ARE ±0.005(±0.13).
4. ALL UNLABELED LEADS ARE GROUND. THESE LEADS ARE
CONNECTED INTERNALLY TO THE PACKAGED BOTTOM GROUND.
THE PACKAGE BOTTOM RF GROUND MUST BE SOLDERED TO
THE PCB RF GROUND.
5. PACKAGE LENGTH AND WIDTH DIMENSIONS SHOWN DO NOT INCLUDE
LID SEAL PROTRUSION. ALLOWABLE PROTRUSION SHALL BE 0.005
(0.127MM) PER SIDE.
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: [phone] Fax: [phone]
7-8
Web Site: www.hittite.com