HMC-XDH158 Datasheet, PDF (3/6 Pages) Hittite Microwave Corporation – GaAs MMIC X4 ACTIVE FREQUENCY MULTIPLIER, 54 - 64 GHz OUTPUT

v01.1207
2
Absolute Maximum Ratings
RF Input Level
Supply Voltage (Vdd1, Vdd2)
Gate Voltage (Vgg1, Vgg2)
Channel Temperature
Storage Temperature
Operating Temperature
+7 dBm
+5 Vdc
-1 to 0.3 Vdc
180 °C
-65 to +150 °C
-55 to +85 °C
Outline Drawing
HMC-XDH158
GaAs MMIC X4 ACTIVE FREQUENCY
MULTIPLIER, 54 - 64 GHz OUTPUT
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
Die Packaging Information ^[1]
Standard
Alternate
WP - 8
[2]
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] For alternate packaging information contact Hittite
Microwave Corporation.
NOTES:
1. ALL DIMENSIONS ARE IN INCHES [MM].
2. TYPICAL BOND PAD IS .004” SQUARE.
3. BACKSIDE METALLIZATION: GOLD.
4. BACKSIDE METAL IS GROUND.
5. BOND PAD METALLIZATION: GOLD.
6. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS.
7. OVERALL DIE SIZE ^{±.002”}
2 - 76
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: [phone] Fax: [phone]
Order On-line at www.hittite.com