HMC690 Datasheet, PDF (10/10 Pages) Hittite Microwave Corporation – 10 Gbps TRANSIMPEDANCE AMPLIFIER

v04.0709
HMC690
10 Gbps TRANSIMPEDANCE
AMPLIFIER
Mounting & Bonding Techniques for Millimeterwave MMICs
The die should be attached directly to the ground plane with epoxy (see
HMC general Handling, Mounting, Bonding Note).
0.18mm (0.007”) Thick MMIC
50 Ohm Microstrip transmission lines on 0.25mm (10 mil) thick alumina
thin film substrates are recommended for bringing RF to and from the chip
(Figure 1).
0.076mm
(0.003”)
Ribbon Bond
Microstrip substrates should be placed as close to the die as possible in
order to minimize bond wire length. Typical die-to-substrate spacing is
0.076mm to 0.152 mm (3 to 6 mils).
RF Ground Plane
Handling Precautions
Follow these precautions to avoid permanent damage.
Storage: All bare die are placed in either Waffle or Gel based ESD protec-
tive containers, and then sealed in an ESD protective bag for shipment.
Once the sealed ESD protective bag has been opened, all die should be
stored in a dry nitrogen environment.
0.25mm (0.010”) Thick Alumina
Thin Film Substrate
Figure 1.
5
Cleanliness: Handle the chips in a clean environment. DO NOT attempt to clean the chip using liquid cleaning sys-
tems.
Static Sensitivity: Follow ESD precautions to protect against ESD strikes.
Transients: Suppress instrument and bias supply transients while bias is applied. Use shielded signal and bias
cables to minimize inductive pick-up.
General Handling: Handle the chip along the edges with a vacuum collet or with a sharp pair of bent tweezers.
Mounting
The chip is not back-metallized and should be die mounted with epoxy. The mounting surface should be clean and
flat.
Epoxy Die Attach: Apply a minimum amount of epoxy to the mounting surface so that a thin epoxy fillet is observed
around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer’s schedule.
Wire Bonding
RF bonds made with two 1 mil wires are recommended. These bonds should be thermosonically bonded with a force
of 40-60 grams. DC bonds of 0.001” (0.025 mm) diameter, thermosonically bonded, are recommended. Ball bonds
should be made with a force of 40-50 grams and wedge bonds at 18-22 grams. All bonds should be made with a
nominal stage temperature of 150 °C. A minimum amount of ultrasonic energy should be applied to achieve reliable
bonds. All bonds should be as short as possible, less than 12 mils (0.31 mm).
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: [phone] Fax: [phone]
Order On-line at www.hittite.com
5 - 11