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W.FL_17 Datasheet, PDF (7/8 Pages) Hirose Electric – Ultra Small Surface Mount Coaxial Connectors 1.4mm or 1.65mm Mated Height
W.FL Series●Ultra Small Surface Mount Coaxial Connectors 1.4mm or 1.65mm Mated Height
BPrecautions
1. Plug
(1) Mating / unmating
• Unmating
Insert both ends of the extraction tool under the plug (from the direction opposite to the
Cable termination), as shown and pull-up in the direction perpendicular to the mounting
surface of the receptacle.
●Recomended the use of the extraction tool for unmating.
Any attempt of unmating by pulling on the cable may result in
W.FL-LP-N plug extraction tool
W.FL Cable
Assembly
damage and affect the mechanical / electrical performance.
W.FL-R-SMT-1
• Mating
qAlign the mating tool W.FL-LP-IN or the mating end
of the tool over the plug end of the cable assembly.
wFirmly place the tool over the plug until it is secured
in the tool.
ePlace the plug cable assembly (held in the tool)over
the corresponding receptacle.
rAssuring that the plug and receptacle are aligned
press-down perpendicular to the mounting surface
until both connectors are fully mated.
tRemove the mating tool by carefully pulling it
up.Removal of the tool.
q
w
(2) Pull forces on the
cable after connectors
are mated
After the connectors are mating, do not apply a load to
the cable in excess of the values indicated in the
diagram.
1MVHQJDLVQ
W.FL
Cable Assembly
W.FL-R-SMT-1
Receptacle
e
r
t
*OTFSUJPOUPBSFDFQUBDMF 3FNPWBMPGUIFUPPM
∞
2N max
∞
(3) Precautions
2. Receptacle
(1) Recommended reflow
temperature profile
Do not twist connectors excessively during mating / unmating.
[ç]
250 ç max. for
10 seconds
260
240
230ç
220
200
Preheat
180
(130 to 180ç)
220ç
160
140
120
100
120 seconds max.
50 seconds max.
80
60 seconds max.
Time
qThe temperature of the printed circuit board surface temperature at the points of contact with the terminals.
wReflow soldering should be performed at a printed circuit surface temperature of 250°C max.
eIn individual applications the actual temperature may vary, depending on the solder paste type, volume /
thickness and board size / thickness. Consuly your solder paste and equipment manufacturer for specific
recommendations.
(2) Recommended metal
mask thickness
0.1 mm to 0.12 mm
(3) Reflow cycles
2 times
3. Operating environment and storage conditions
(1) Operating
environment
(2) Storage conditions -
Receptacle
The connectors are not designed to operate in the following environments:
• Exposed to a excessive amounts of fine particles and dust
• Regions and places having a high density of sulfur dioxide, hydrogen sulfide, nitrogen dioxide or other corrosive gasses.
• Environments having large rapid variations in temperature.
Store in the Hirose Electric packaging.
Temperature: -10 to +40ç, Humidity: 85% max.
Use within 6 months of delivery.
Receptacles for which the storage period has elapsed must be tested for solderability to the PC board
mounting surface.
7