DF20 Datasheet, PDF (7/7 Pages) Hirose Electric – 1 mm Pitch Double Rows Low Profile Board-to-Cable Connectors

The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
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BUsage recommendation
1. Recommended Soldering
Temperature Profile for IR Reflow.
Temperature
250
200
DF20F– *DP – 1H(59)
240
220
10(s) max
150
60 to 120(s)
60(s) max
100
60
120
180
240
300
Time(S)
Note 1: Up to 2 cycles of reflow soldering are possible under the same conditions, provided
that there is a return to normal temperature between the first and second cycle.
Note 2: The temperature indicates the board surface temperature at the points of contacts
with the connector terminals.
2. Recommended Manual Soldering Conditions Soldering temperature: 290°C ±10°C, Soldering time: within 3 sec.
3. Recommended Solder Screen Thickness 0.15mm
4. Board Warping
Maximum of 0.03 mm at the connector center section, with both ends of the connector as reference points.
5. Cleaning Conditions
Refer to "Nylon Connector Use Handbook."
6. Wiring Termination Conditions
Refer to "Nylon Connector Use Handbook."
Crimp contacts should be handled with care as not to cause any deformation or damage
affecting the performance or termination.
7. Mating / un-mating precautions _{Excessive twisting and pulling on wires during mating/un-mating should be avoided as it}
may cause damage to connectors.
B272
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