IC9-68RD-0.635SF Datasheet, PDF (4/4 Pages) Hirose Electric – Card Bus Socket Connectors

BPCB mounting pattern
BTemperature Profile
5 s.max
250
240ç
200
200ç
150
150ç
160ç
100
50
(30s)
25ç _(60s)
(60 to 90s)
0
Preheating
start
60
120
(20 to 30s)
Soldering
Time(seconds)
Applicable Conditions
Reflow system ^: IR reflow
Solder
: Paste type 63 Sn/37 Pb
(Flux content 9 wt%)
Test board Glass epoxy 60mm x 60mm x 1.6 mm
Metal mask thickness: 0.15 mm
Recommended temperature profile.
The temperature may be slightly changed according to the
solder paste type and amount.
A51