DF151.830DS-0.65V56 Datasheet, PDF (10/10 Pages) Hirose Electric – 0.65mm Pitch SMT Board to Board Connector

The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
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BPrecautions
1. Recommended Temperature Profile (SMT)
Temperature (ç)
250
200
150 150ç
100
250ç
220ç
180ç
60sec max
Soldering
90~120sec
Preheating
50
Room temperature
0
50
100
150
200
250
300
Time (sec.)
Note1: Up to 2 cycles of Reflow soldering are possible under the same conditions, provided that
there is a return to normal temperature between the first and second cycle.
Note2: The temperature profile indicates the board surface temperature at the point of contacts
with the connector terminals.
2. Recommended Manual Soldering Condition (SMT) Soldering iron temperature: 350±10ç, Soldering time: Within 3 seconds
3. Recommended Screen Thickness (SMT) 0.15mm
4. Board Warp (SMT)
Max 0.02mm in the connector center area, based on the both connector edges
5. Cleaning Condition
Refer to the "Nylon Connector Use Hand book".
6. Cautions
sThe receptacle is designed in a structure where contacts are exposed. Touching it with bare
hands would cause contact failure or electrostatic element damage.
sWhere no board is mounted, the insertion or extraction will cause damage or deformation in the contacts.
sAvoid retaining the board with the connector only, and fix the board by any other means than the connector.
sExcessive scoop insertion or extraction may result in damage.
sIn the manual soldering process, don't carry out the flux coating which will cause a flux blister on the connector.
sThe color phase of this product may be slightly different from that of the formed product
according to the manufacturing lot. However, the difference doesn't affect the performance.
A165