CB1G-10S-1.5H-PEJC2 Datasheet, PDF (10/10 Pages) Hirose Electric – Memory Stick Connectors

sRecommended Temperature Profile
300ç
200ç
IR Reflow Conditions
Preheating : 150ç 30 to 90 sec.
Soldering : 235±5ç 10 sec. max.
220ç min. 10 to 20 sec.
150ç
100ç
Preheating
240ç max.
220ç
Soldering
0ç
0S
50S
100S
150S
<Recommended Conditions>
Reflow system : IR reflow
Solder
: Paste type 63 Sn/37 Pb (Flux content 9 wt%)
Test board
: Glass epoxy 60mm x 100mm x 1.6 mm
Metal mask thickness
: 0.15 mm
Recommended temperature.
The temperature may be slightly changed according to the solder paste type and volume used.
200S
10