MCR89-130D-1.27DSA Datasheet, PDF (1/4 Pages) Hirose Electric – Socket for Memory Module Board

Socket for Memory Module Board
MCR89 Series
FEM Design
Simulation
Designed in Miniature 2
Contacts with High
Precision Spring
sFeatures
1. High Reliability
4. Miniature Type and High Density Mounting
This socket achieves high reliability in the horizontal
contact spring system.
2. Low Insertion Force
This socket prevents mis-insertion force in the preload
structure.
3. Easy Pattern Design
The dip contact through-hole diameter is only Ø0.5, and
simplifies the pattern design.
The low profile with 6.2mm height from the board is
suitable for miniaturization of equipment. The 1.27mm pitch
between contacts assures mounting with high density.
5. Wide Effective Mounting Area
This socket is capable of widening the effective mounting
area on the module printed board, and secures retention
function by easy locking.
6. Easy Board Mounting
The fixing pins are arranged in the same alignment as the
contact, so as to easily install the connector in the board.
7. Accessories
sProduct Specifications
Dust covers and jigs to remove the board are available.
Rating
Current rating: 0.5A Operating Temperature Range: -30 to +85ç (Note 1) Storage Temperature Range: -10 to +60ç (Note 2)
Voltage rating: 125V AC Operating Humidity Range: 40 to 80%
Storage Temperature Range: 40 to 70% (Note 2)
Item
Specification
1. Contact Resistance 1000M ohms min.
2. Withstanding voltage No flashover or insulation breakdown.
3. Insulation Resistance 20m ohms max.
4. Vibration
No electrical discontinuity of 10 µs or more
Conditions
500A DC
500V DC / 1 minute
100mA
Frequency: 10 to 55 Hz, single amplitude of 0.75 mm, 2 hours in each of the 3 directions.
5. Humidity (Steady state) Insulation Resistance:1000M ohms min.
96 hours at temperature of 40ç and humidity of 90% to 95%
5 cycles under following condition;
6. Temperature Cycle No damage, cracks, or parts looseness.
Temperature : -55: 30 minutes¡ +5 to 35ç: 5 minutes max.¡
85ç
: 30 minutes¡15- to 30ç 5 minutes max.)
7. Durability (Insertion/withdrawal) Contact resistance: 20m ohms max.
200 cycles
8. Resistance to Soldering heat No deformation of components affecting performance. Manual soldering: 300ç for 3 seconds
Note 1: Includes temperature rise caused by current flow.
Note 2: The term "storage" refers to products stored for long period of time prior to mounting and use. Operating Temperature Range
and Humidity range covers non- conducting condition of installed connectors in storage, shipment or during transportation.
D2