IT3D-100S-BGA37 Datasheet, PDF (1/20 Pages) Hirose Electric – High-Speed(10+Gbps) BGA Mezzanine Connectors

NEW
High-Speed(10⁺Gbps) BGA Mezzanine Connectors
IT3 Series
Interposer
Signal
Ground
Signal / Ground Configuration
sFlexibility
Hirose’s IT3 mezzanine connector system is as
comfortable in today’s data rates of PCIe and XAUI
as it is in tomorrow’s 10⁺Gbps systems.
With the ability to transmit differential, single-ended,
and power through one package and being stackable
from 15 – 40mm, IT3 can solve your interface needs
for both current and future generations.
sMechanical features
q Unique 3-piece structure for flexibility
q Stacking heights from 15 to 40mm
(^*15mmH is 2-piece)
q Staggered 1.5mm ∞ 1.75mm ball grid array
q Number of Contacts: 100, 200, &300 signals
+ 90% additional grounds
q Differential, single-ended, and power
q Low mating/extracting forces
q Wide misalignment tolerances for multiple
connector use
q Both of SnPb and Pb-free are available
q Excellent reflow solderability
sSignal integrity features
q Insertion loss to Crosstalk Ratio (ICR)
The ICR performance meets the extrapolated ^
IEEE 802.3ap specification for 6.25Gbps with ^
fully-populated pin assignment, and 10⁺Gbps 
with skipped pin assignment.

q Return Loss

The differential return loss meets the
extrapolated IEEE 802.3ap specification ^
up to 12GHz.





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sStacking height variations
Stacking Height
Contact Position
100
200
300
17mm
*
20mm
22mm
*
25mm
26mm
28mm
30mm
*
32mm
*
38mm 40mm
* : Under planning
2010.02
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