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DX30AM-50P Datasheet, PDF (1/18 Pages) Hirose Electric – HIGH-DENSITY I/O CONNECTOR
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.
General
DXM (1.27MM PITCH) SERIES
HIGH-DENSITY I/O CONNECTOR
DXM series high-density I/O connectors with bellow
contacts are perfect for tomorrow's miniaturized elec-
tronic devices. This new 1.27mm (0.050") interconnect
design ensures positive locking, effortless coupling,
terminal protection and EMI reduction in a miniaturized
and rugged package. DXM series offer you one of the
most varied and complete lines of High-Density con-
nectors in the world, i.e. IDC and Solder for the plug
and right angle dip, straight dip, IDC and SMT for the
receptacle. Available in 14, 20, 26, 36, 50, 68, 80, 100
and 110 way.
Features
1. 1.27mm (0.050") contact spacing conserves valu-
able board space and permits ultra-high density
designs.
2. Bellow contacts create smooth and precise mating
and unmating.
3. Unique shell design assures first make/last break
grounding and overall noise protection.
4. IDC termination allows quick and low cost termina-
tion to AWG #28 wires.
5. Backshell and receptacle shell are made of die-
cast zinc alloy or stainless steel to reduce the
penetration of external EMI noise.
6. Ferrite added to DX Right Angle Dip Type for EMI
Protection is available.
7. Overmold backshell provided for ESD protection is
available in 'One-Touch' locking and 'Screw' lock-
ing.
8. Termination methods are available in IDC, Solder-
ing, Right Angle Dip, Straight Dip and SMT.
Application
Office Autmation, Computers, Measurement, Communication
and Control Equipment, Factory Automation, Home Automa-
tion and other commercial applications needing high density
interconnections.
Specifications
*UFNT
$VSSFOUDBQBDJUZ
3BUFEWPMUBHF
*OTVMBUJPOSFTJTUBODF
$POUBDUSFTJTUBODF
8JUITUBOEJOHWPMUBHF
4UBOEBSEWBMVF
"
"$7
.Њ PSNPSFBU%$7
NЊ PSMFTTBU%$N"
"$7SNTGPSNJOVUF
223
04/2009