520PG2C-F2 Datasheet, PDF (8/11 Pages) HB Electronic Components – 5.0 mm DIA LED LAMP

5.0 mm DIA LED LAMP
520PG2C-F2
REV:A / 0
yFORMED LEAD
1) The lead should be bent at a point located at least 2mm away from the package. Bending
should be performed with base fixed means of a jig or pliers (Fig.7)
Fig.7
2) Forming lead should be carried our prior to soldering and never during or after soldering.
3) Form the lead to ensure alignment between the leads and the hole on board, so that stress
against the LED is prevented. (Fig.8)
yLEAD STRENGTH
1) Bend strength
Do not bend the lead more than twice. (Fig.9)
Fig.9
DRAWING NO. : DS-35-08-0395
DATE : 2008-12-24
Page :8