940MWO4C Datasheet, PDF (5/10 Pages) HB Electronic Components – LED

2. Technical Requirement in Led Application.
A. Leads forming
Methods:
(1) Bending frame 2mm from colloid.
(2) Using clamp or operated by professional staff.
(3) Frame forming must be finished before soldering.
(4) Leads distance must be consistent to circuit board.
(5) Do not add external power squeezing leds colophony to avoid damaging PINs in
colloid.
(6) Avoiding bending in the same position of leads twice or more.
B. Installation
Led Installation methods
(1) Attention on the arrangement of external cables of parts where leds fixed to avoid
wrong electrode installation. Parts should be away from heat source and operated
under it’s limited working conditions.
(2) Leds with distorted leads are not allowed installed.
(3) Don’t press leads when Leds are installed on bottom board.
(4) Guide cap is recommend to use for Leds positioning.
(5) Avoid any vibration or external strength before soldering temperature turn back to
normal.
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