913MY8C Datasheet, PDF (5/9 Pages) HB Electronic Components – FLUX LED

LED LAMP APPLICATION
ySOLDERING
METHOD
SOLDERING CONDITIONS
REMARK
y Solder no closer than 3mm from the
DIP
Bath temperature: 260±5℃
base of the package
SOLDERING
Immersion time: with 5 sec
y Using soldering flux,” RESIN FLUX”
is recommended.
y During soldering, take care not to
press the tip of iron against the
Soldering iron: 30W or smaller
lead.
SOLDERING _{Temperature at tip of iron: 260℃ or lower (To prevent heat from being}
IRON
Soldering time: within 5 sec.
transferred directly to the lead, hold
the lead with a pair of tweezers
while soldering
1) When soldering the lead of LED in a condition that the package is fixed with a panel (See Fig.1),
be careful not to stress the leads with iron tip.

Lead wries
Panel
(Fig.1)
2) When soldering wire to the lead, work with a Fig (See Fig.2) to avoid stressing the package.

Lead wries
Leave a slight
clearance
(Fig.2)
Page : 5