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825MR2C Datasheet, PDF (4/6 Pages) HB Electronic Components – Single color | |||
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Hebei I.T. (Shanghai) Co., Ltd.
LED SPECIFICATION
Part No./åå·ï¼825MR2C
à Lead Forming/æå½¢
1. Any lead forming or bending must be done before soldering.
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2. When forming leads, there must be a minimum of 2mm clearance between the base of the LED lens
and the lead bend.
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3. Avoid bending the leads at the same point more than once.
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4. During assembly onto PCB, the lead pitch of the LED must match the pitch of the mounting holes
on the PCB during component placement.
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à Soldering Condition/çæ¥æ¡ä»¶
Careful attention should be paid during soldering. When soldering, leave more then 2mm from solder
joint to case, and soldering beyond the base of the tie bar is recommended.
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Avoiding applying any stress to the lead frame while the LEDs are at high temperature particularly
when soldering.
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www.ledz.com
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