E12EB7C-O Datasheet, PDF (3/5 Pages) HB Electronic Components – High reliability and Very long operating life

Hebei I.T. (Shanghai) Co., Ltd.
Heat Plate Soldering Condition
1. Soldering Process for Solder Paste
LED SPECIFICATION
Use Solder Mask to print Solder Paste on MCPCB.
Place Emitter on MCPCB.
Put MCPCB on Heat Plate until Solder Paste melt. Put Emitter on MCPCB. Take the MCPCB out
The Solder Paste sould be melted within 10 seconds. from Heat Plate within 10 seconds.
Take out MCPCB out from Heat Plate within 10 seconds.
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