S10227 Datasheet, PDF (4/4 Pages) Hamamatsu Corporation – CMOS linear image sensor Small plastic package CMOS image sensor

CMOS linear image sensor S10227
s Pin connection
Pin no.
Name
➀
GND
➁
NC
➂
NC
➃
Vdd
➄
Video
➅
EOS
➆
st
➇
clk
Ground
Description
Power supply voltage
Video signal output
End of scan (Shift register end-of-scan signal pulse generated after reading
signals from all pixels)
Start pulse (Pulse for initializing the internally generated pulses that set the
timing to start reading pixel signals)
Clock pulse (Pulse for synchronizing the internally generated pulses that
control sensor operation frequency)
Input/output
Input
-
-
Input
Output
Output
Input
Input
s Recommended land pattern
(8 ×) 0.7
s Temperature profile of reflow soldering
250
200
150
2.54
2.54
2.54
100
KMPDC0257EA
50
0
0 50 100 150 200 250 300 350
Time (s)
KMPDB0261EA
s Precautions for use
(1) Electrostatic countermeasures
· This device has a built-in protection circuit as a safeguard against static electrical charges. However, to prevent destroying
the device with electrostatic charges, take countermeasures such as grounding yourself, the workbench and tools to prevent
static discharges.
· Protect this device from surge voltages which might be caused by peripheral equipment.
(2) Package handling
· The package surface is easily scratched, so handle this device carefully.
· Dust or grime on the light input window might cause non-uniform sensitivity. To remove dust or grime, blow it off with
compressed air.
(3) Reflow soldering
· To prevent damaging this device during reflow soldering, perform soldering within 24 hours after opening the moisture-proof
packing.
· The extent of damage that might occur during reflow soldering depends on the PC board size and reflow oven conditions.
Check the device for any damage before reflow soldering.
(4) Surface protective tape
· Protective tape is affixed to the surface of this product to protect the active area. After assembling the product, remove the
tape before use.
Information furnished by HAMAMATSU is believed to be reliable. However, no responsibility is assumed for possible inaccuracies or omissions.
Specifications are subject to change without notice. No patent rights are granted to any of the circuits described herein.
Type numbers of products listed inthe specification sheets or supplied as samples may have a suffix "(X)" which means tentative specifications or a suffix "(Z)"
HAMAMATSU PHOTONICS K.K., Solid State Division ^{which means developmental specifications. ©2010 Hamamatsu Photonics K.K.}
1126-1 Ichino-cho, Higashi-ku, Hamamatsu City, 435-8558 Japan, Telephone: [phone], Fax: [phone], www.hamamatsu.com
U.S.A.: Hamamatsu Corporation: 360 Foothill Road, P.O.Box 6910, Bridgewater, N.J. 08807-0910, U.S.A., Telephone: [phone], Fax: [phone]
Germany: Hamamatsu Photonics Deutschland GmbH: Arzbergerstr. 10, D-82211 Herrsching am Ammersee, Germany, Telephone: [phone], Fax: [phone]
France: Hamamatsu Photonics France S.A.R.L.: 19, Rue du Saule Trapu, Parc du Moulin de Massy, 91882 Massy Cedex, France, Telephone: [phone], Fax: [phone]
United Kingdom: Hamamatsu Photonics UK Limited: 2 Howard Court, 10 Tewin Road, Welwyn Garden City, Hertfordshire AL7 1BW, United Kingdom, Telephone: [phone], Fax: [phone]
North Europe: Hamamatsu Photonics Norden AB: Smidesvägen 12, SE-171 41 Solna, Sweden, Telephone: [phone], Fax: [phone]
Italy: Hamamatsu Photonics Italia S.R.L.: Strada della Moia, 1 int. 6, 20020 Arese, (Milano), Italy, Telephone: [phone], Fax: [phone]
Cat. No. KMPD1099E05
Jun. 2010 DN
4