S10121_15 Datasheet, PDF (12/13 Pages) Hamamatsu Corporation – CMOS linear image sensors

CMOS linear image sensors
S10121 to S10124 series
Pin connections
Index mark
ST 1
INT 2
Vofg 3
Vdd 4
GND 5
GND 6
Vdd 7
Vofd 8
Active Video 9
Dummy Video 10
GND 11
22 CLK
21 NC
20 NC
19 NC
18 NC
17 NC
16 NC
15 NC
14 NC
13 NC
12 EOS
KMPDC0230EC
Pin no.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
Symbol
ST
INT
Vofg
Vdd
GND
GND
Vdd
Vofd
Active Video
Dummy Video
GND
EOS
NC
NC
NC
NC
NC
NC
NC
NC
NC
CLK
Name of pin
Start pulse
Integration time control pulse
Overflow gate voltage
Supply voltage
Ground
Ground
Supply voltage
Overflow drain voltage
Video output
Dummy video output
Ground
End of scan
No connection
Clock pulse
I/O
Input
Input
Input
Input
Input
Input
Input
Input
Output
Output
Input
Output
Input
Precautions during use
(1) Electrostatic countermeasures
This device has a built-in protection circuit against static electrical charges. However, to prevent destroying the device with electro-
static charges, take countermeasures such as grounding yourself, the workbench and tools to prevent static discharges. Also protect
this device from surge voltages which might be caused by peripheral equipment.
(2) Incident window
If dust or dirt gets on the light incident window, it will show up as black blemishes on the image. When cleaning, avoid rubbing the
window surface with dry cloth or dry cotton swab, since doing so may generate static electricity. Use soft cloth, paper or a cotton
swab moistened with alcohol to wipe dust and dirt off the window surface. Then blow compressed air onto the window surface so
that no spot or stain remains.
(3) Soldering
To prevent damaging the device during soldering, take precautions to prevent excessive soldering temperatures and times. Solder-
ing should be performed within 5 seconds at a soldering temperature below 260 °C.
(4) Operating and storage environments
Always observe the rated temperature range when handling the device. Operating or storing the device at an excessively high tem-
perature and humidity may cause variations in performance characteristics and must be avoided.
(5) UV exposure
This device is designed to suppress performance deterioration due to UV exposure. Even so, avoid unnecessary UV exposure to the
device. Also, be careful not to allow UV light to strike the cemented portion of the glass.
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