S10111 Datasheet, PDF (11/11 Pages) Hamamatsu Corporation – Current-output type sensors with variable integration time function

CMOS linear image sensors
S10111 to S10114 series
Pin connection
Index mark
ST 1
INT 2
Vofg 3
Vdd 4
GND 5
GND 6
Vdd 7
Vofd 8
Active Video 9
Dummy Video 10
GND 11
22 CLK
21 NC
20 NC
19 NC
18 NC
17 NC
16 NC
15 NC
14 NC
13 NC
12 EOS
KMPDC0230EC
Pin no.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
Symbol
ST
INT
Vofg
Vdd
GND
GND
Vdd
Vofd
Active Video
Dummy Video
GND
EOS
NC
NC
NC
NC
NC
NC
NC
NC
NC
CLK
Name of pin
Start pulse
Integration time control pulse
OverÀow gate voltage
Supply voltage
Ground
Ground
Supply voltage
OverÀow drain voltage
Video output
Dummy video output
Ground
End of scan
No connection
Clock pulse
I/O
Input
Input
Input
Input
Input
Input
Input
Input
Output
Output
Input
Output
Input
Precautions during use
(1) Electrostatic countermeasures
This device has a built-in protection circuit against static electrical charges. However, to prevent destroying the device with electrostatic
charges, take countermeasures such as grounding yourself, the workbench and tools to prevent static discharges. Also protect this de-
vice from surge voltages which might be caused by peripheral equipment.
(2) Incident window
If dust or dirt gets on the light incident window, it will show up as black blemishes on the image. When cleaning, avoid rubbing the
window surface with dry cloth or dry cotton swab, since doing so may generate static electricity. Use soft cloth, paper or a cotton swab
moistened with alcohol to wipe dust and dirt off the window surface. Then blow compressed air onto the window surface so that no spot
or stain remains.
(3) Soldering
To prevent damaging the device during soldering, take precautions to prevent excessive soldering temperatures and times. Soldering
should be performed within 5 seconds at a soldering temperature below 260 °C.
Information furnished by HAMAMATSU is believed to be reliable. However, no responsibility is assumed for possible inaccuracies or omissions.
Specifications are subject to change without notice. No patent rights are granted to any of the circuits described herein.
Type numbers of products listed in the specification sheets or supplied as samples may have a suffix “(X)” which means tentative specifications or a suffix “(Z)”
which means developmental specifications. ©2010 Hamamatsu Photonics K.K.
www.hamamatsu.com
HAMAMATSU PHOTONICS K.K., Solid State Division
1126-1 Ichino-cho, Higashi-ku, Hamamatsu City, 435-8558 Japan, Telephone: [phone], Fax: [phone]
U.S.A.: Hamamatsu Corporation: 360 Foothill Road, P.O.Box 6910, Bridgewater, N.J. 08807-0910, U.S.A., Telephone: [phone], Fax: [phone]
Germany: Hamamatsu Photonics Deutschland GmbH: Arzbergerstr. 10, D-82211 Herrsching am Ammersee, Germany, Telephone: [phone], Fax: [phone]
France: Hamamatsu Photonics France S.A.R.L.: 19, Rue du Saule Trapu, Parc du Moulin de Massy, 91882 Massy Cedex, France, Telephone: [phone], Fax: [phone]
United Kingdom: Hamamatsu Photonics UK Limited: 2 Howard Court, 10 Tewin Road, Welwyn Garden City, Hertfordshire AL7 1BW, United Kingdom, Telephone: [phone], Fax: [phone]
North Europe: Hamamatsu Photonics Norden AB: Smidesvägen 12, SE-171 41 Solna, Sweden, Telephone: [phone], Fax: [phone]
Italy: Hamamatsu Photonics Italia S.R.L.: Strada della Moia, 1 int. 6, 20020 Arese, (Milano), Italy, Telephone: [phone], Fax: [phone]
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Cat. No. KMPD1090E07 Oct. 2010 DN