S7199-01_11 Datasheet, PDF (1/8 Pages) Hamamatsu Corporation – CCD area image sensor Front-illuminated FFT-CCDs for X-ray imaging

IMAGE SENSOR
CCD area image sensor
S7199-01
Front-illuminated FFT-CCDs for X-ray imaging
S7199-01 is a family of FFT-CCD image sensors specifically designed for X-ray imaging. A FOS (Fiber Optic plate with
Scintillator) that converts X-ray into visible-light is mounted on the CCD chip, which enables S7199-01 to acquire the X-ray
imaging. Two CCD chips of symmetric from side to side are mounted closely for realizing the possible minimum dead space in
between. The effective photosensitive length of about 150 mm in total is realized; each chip has 1536 × 128 pixels and the pixel
size is 48 × 48 µm. Even a X-ray image of moving object can be taken by taking a unique operation method of TDI, which can also
be useful for a non-destructive inspection where the object moves on a belt conveyer.
The each chip of S7199-01 has an effective pixel size of 48 × 48 µm and is available in active area of 73.728 (H) × 6.144 (V) mm².
FOP type is also available (S7199-01F).
Features
l 1536 (H) × 128 (V) pixel format
l Pixel size: 48 × 48 µm
l Buttable structure of 2 chips
l Coupled with FOS for X-ray imaging
l TDI (Time Delay Integration) operation
l 100 % fill factor
l Wide dynamic range
l Low dark signal
l Low readout noise
l MPP operation
Applications
l General X-ray imaging
l Non-destructive inspection
l Dental panorama
s Selection guide
Type No.
W indow
C o o lin g
Number of
total pixels
Number of
active pixels
Active area
[m m (H) × mm (V)]
FOS
S7199-01
(fiber optic plate
with scintillator)
N o n -c o o le d
1536 × 128
1536 × 128
73.728 × 6.144
S7199-01F*
FOP
(fiber optic plate)
Note) As an input window, FOS is suited to S7199-01.
* W hen this product is used for X-ray detection applications, the user should assem ble a scintillator or phosphor sheet.
s G eneral ratings
Param eter
S7199-01
S7199-01F
CCD structure
Full frame transfer or TDI
Fill factor
100 %
Num ber of active pixels
1536 (H) × 128 (V) *¹
Pixel size
48 (H) × 48 (V) µm
CCD active area
73.728 (H) × 6.144 (V) mm *¹
X-ray sensitive area
146 × 6 mm
Vertical clock phase
2 phase
Horizontal clock phase
2 phase
Output circuit
Two-stage MO SFET source follower with load resistance
X-ray resolution
4 to 6 Lp/m m at 60 kVp, 20 µGy
-
To ta l d ose irra dia tio n
50 Gy max.
Package
40 pin ceram ic package
*1: Num ber of active pixels per chip. Two chips are used.
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