S5980 Datasheet, PDF (1/2 Pages) Hamamatsu Corporation – Multi-element photodiodes for surface mounting

PHOTODIODE
Si PIN photodiode
S5980, S5981, S5870
Multi-element photodiodes for surface mounting
Features
Applications
l Large active area
S5980: 5 × 5 mm
S5981: 10 × 10 mm
S5870: 10 × 10 mm
l Chip carrier package suitable for surface mounting
Facilitates automated surface mounting by solder reflow
l Thin package: 1.26 mmt
l Photo sensitivity: 0.72 A/W (λ=960 nm)
l Laser beam axis alignment
l Level meters
l Pointing devices, etc.
s General ratings
Parameter
Window material
Gap between elements
Active area
Symbol
-
-
A
S5980
φ5.0/4 elements
S5981
Resin coating
30
φ10.0/4 elements
S5870
Unit
-
µm
φ10.0/2 elements
mm
s Absolute maximum ratings
Parameter
Symbol
Reverse voltage
VR Max.
O perating te mp erature Topr
Storage temperature Tstg
S5980
S5981
30
-40 to +100
-40 to +125
S5870
Unit
V
°C
°C
s Electrical and optical characteristics (Ta=25 °C, per 1 element)
Parameter
Symbol
Condition
S5980
Typ.
Max.
Spectral response range λ
320 to 1100 -
Peak sensitivity
wavelength
λp
960
-
Photo sensitivity
S λ=λp
0.72
-
Dark current
ID VR=10 V
0.3
2
Te mperature coefficient of ID TCID
1.15
-
Cut-off frequency
fc VR=10 V, RL=50 Ω, -3 dB 25
-
T er minal c apacita nce Ct VR=10 V, f=1 MHz
10
-
Noise equivale nt po wer NEP VR=10 V, λ=λp
1.4 × 10^-14
-
Note) S5980: For mass production, order unit is 100 pieces.
S5981, S5870: For mass production, order unit is 50 pieces.
S5981
Typ.
Max.
320 to 1100 -
960
-
0.72
-
0.6
4
1.15
-
20
-
35
-
1.9 × 10^-14
-
S5870
Typ.
Max.
320 to 1100 -
960
-
0.72
-
2
10
1.15
-
10
-
50
-
3.5 × 10^-14
-
Unit
nm
nm
A/W
nA
times/°C
MHz
pF
W/Hz^1/2
Precautions for use
q The light input window of this product uses soft silicone resin. Avoid touching the window to keep it from grime and damage that
can decrease sensitivity. External force applied to the resin surface may deform or cut off the wires, so do not touch the window
to prevent such troubles.
q Use rosin flux when soldering, to prevent the terminal lead corrosion. Reflow oven temperature should be at 260 °C maximum for 5
seconds maximum time under the conditions that no moisture absorption occurs.
Reflow soldering conditions differ depending on the type of PC board and reflow oven. Carefully check these conditions before use.
q Silicone resin swells when it absorbs organic solvent, so do not use any solvent other than alcohol.
q Avoid unpacking until you actually use this product to prevent the terminals from oxidation and dust deposits or the coated resin
from absorbing moisture.
When the product is stored for 3 months while not unpacked or 24 hours have elapsed after unpacking, perform baking in
nitrogen atmosphere at 150 °C for 3 to 5 hours or at 120 °C for 12 to 15 hours before use.
1