S12158-01CT_KPIN1084E01 Datasheet, PDF (1/4 Pages) Hamamatsu Corporation – S12158-01CT

Si PIN photodiode
S12158-01CT
COB type, applicable to lead-free solder reflow
The S12158-01CT is a Si PIN photodiode for visible to near infrared range and is compatible with lead-free solder reflow pro-
cesses. The small and thin leadless package allows reducing the mount area on a printed circuit board.
Features
COB type, small and thin leadless package
Applicable to lead-free solder reflow
Photosensitive area: 2.77 × 2.77 mm
High sensitivity: 0.7 A/W (λ=960 nm)
Applications
FSO (free space optics)
Optical switches
Laser radar, etc.
Structure
Parameter
Photosensitive area
Package
Seal material
Specification
Unit
2.77 × 2.77
mm
Glass epoxy
-
Epoxy resin
-
Absolute maximum ratings
Parameter
Symbol
Condition
Value
Unit
Reverse voltage
VR max Ta=25 °C
20
V
Operating temperature
Topr
-25 to +85
°C
Storage temperature
Tstg
-40 to +100
°C
Reflow soldering conditions*¹
Tsol
Peak temperature 260 °C, 2 times (see page 4)
-
Note: Exceeding the absolute maximum ratings even momentarily may cause a drop in product quality. Always be sure to use the
product within the absolute maximum ratings.
*1: JEDEC level 4
Electrical and optical characterisitcs (Ta=25 °C)
Parameter
Symbol
Condition
Min.
Spectral response range
λ
-
Peak sensitivity wavelength
λp
-
Photosensitivity
S λ=λp
0.6
Dark current
ID VR=12 V
-
Temperature coefficient of ID
TCID VR=12 V
-
Cutoff frequency
fc
VR=12 V, RL=50 Ω
-3 dB
10
Terminal capacitance
Ct VR=12 V, f=1 MHz
-
Typ.
320 to 1100
960
0.7
0.1
1.15
25
15
Max.
-
-
-
10
-
-
30
Unit
nm
nm
A/W
nA
times/°C
MHz
pF
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