C12200-461 Datasheet, PDF (1/2 Pages) Hamamatsu Corporation – X-ray TDI Camera

MEASUREMENT EXAMPLES
Void inspection of BGAs
Line sensor reduced
X-ray irradiation area
X-ray TDI camera
X-ray TDI camera can inspect the samples easily by high
speed scan with narrow irradiate area.
S/N ratio is one of advantage and low X-ray radiation is
enough to inspect the void existence.
Furthermore it contribute to make a smaller size of system
by reducing a lot of X-ray irradiation.
X-ray light
source
X-ray TDI camera can reduce the X-ray irradiation
on the sample dramatically by high speed with
narrow irradiation area. So it can reduce the risks
to break down the ICs on the PC.
DIMENSIONAL OUTLINES (Unit: mm)
C12200-321 (Approx. 5 kg)
360±0.5
300
30
221.184 * (Sensor range)
32.9
C12200-461 (Approx. 7 kg)
25±0.5
160±0.5
370±0.5
160±0.5
4-φ4.5
A8206-35 (Option)
(Approx. 2 kg)
147
(38.264±0.5)
293.472 * (Sensor range)
6−φ4.5
270±0.5
302.2
16.1 2-M4 D=6
* ^{Sensor length is a theoretical value and does not include the dead space between CCDs. In case of overlapped type, the overlapped pixels are defined as 10 pixels.}
OPTIONS
Power supply unit : A8206-35
Power cable: A10847-05 (5 m)
Software API Support (Microsoft Windows): DCAM-API (http://www.dcamapi.com)
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Specifications and external appearance are subject to change without notice.
© 2014 Hamamatsu Photonics K.K.
HAMAMATSU PHOTONICS K.K. ^{www.hamamatsu.com}
HAMAMATSU PHOTONICS K.K., Systems Division
812 Joko-cho, Higashi-ku, Hamamatsu City, 431-3196, Japan, Telephone: [phone], Fax: [phone], E-mail: [e-mail]
U.S.A.: Hamamatsu Corporation: 360 Foothill Road, Bridgewater. N.J. 08807-0910, U.S.A., Telephone: [phone], Fax: [phone] E-mail: [e-mail]
Germany: Hamamatsu Photonics Deutschland GmbH: Arzbergerstr. 10, D-82211 Herrsching am Ammersee, Germany, Telephone: [phone], Fax: [phone] E-mail: [e-mail]
France: Hamamatsu Photonics France S.A.R.L.: 19, Rue du Saule Trapu, Parc du Moulin de Massy, 91882 Massy Cedex, France, Telephone: [phone], Fax: [phone] E-mail: [e-mail]
United Kingdom: Hamamatsu Photonics UK Limited: 2 Howard Court, 10 Tewin Road, Welwyn Garden City, Hertfordshire AL7 1BW, United Kingdom, Telephone: [phone], Fax: [phone] E-mail: [e-mail]
North Europe: Hamamatsu Photonics Norden AB: Torshamnsgatan 35 SE-164 40 Kista, Sweden, Telephone: [phone], Fax: [phone] E-mail: [e-mail]
Italy: Hamamatsu Photonics Italia S.r.l.: Strada della Moia, 1 int. 6, 20020 Arese (Milano), Italy, Telephone: [phone], Fax: [phone] E-mail: [e-mail]
China: Hamamatsu Photonics (China) Co., Ltd.: B1201 Jiaming Center, No.27 Dongsanhuan Beilu, Chaoyang District, Beijing 100020, China, Telephone: [phone], Fax: [phone] E-mail: [e-mail]
Cat. No. SFAS0026E07
JAN/2014 HPK
Created in Japan
X-ray TDI Camera
C12200 Series
High speed readout Large field of view High Resolution
High Sensitivity
Evolutional high speed scanning with
TDI technology
High speed readout
36.8
m/min.
Detection area
293
mm
Horizontal spatial
resolution
6144
pixels
X-ray TDI camera C12200 Series is useful for in-line
applications requiring high-speed operation with high
sensitivity. TDI imaging is appropriate for applications where
it is desired to record a linear movement, or where the aspect
ratio of the subject being imaged is significantly asymmetric.
Low brightness under high resolution usage, a problem with
conventional line sensor cameras, is improved with this X-ray
TDI camera, making it suitable for applications which require
high resolution.
TDI technology
Time Delay Integration is a technology of scanning in
which a frame transfer device produces a continuous
video image of a moving object by means of a stack
of linear arrays aligned with and synchronized to the
motion of the object to be imaged in such a way that,
as the image moves from one line to the next, the
integrated charge moves along with it, providing
higher resolution at lower light levels than is possible
with a line-scan camera.
Shield box
X-ray source
Object motion
Object
Conveyor belt
X-ray TDI Camera
TDI sensor
Signal intensity
Printed circuit board (PCB) inspection
Surface-mounted component inspection
Battery inspection
High-resolution in-line non-destructive inspection
Features
High S/N ratio with 12 bit (-321) / 16 bit (-461) output
Camera Link interface (Base configuration)
Single power supply (+15 V) operation
Real time dark current / shading correction function
Frame readout mode for easy installation alignment