G5E2596M Datasheet, PDF (3/6 Pages) GTM CORPORATION – 150 KHz, 3A PWM Step-Down DC/DC Converter

ISSUED DATE :2005/12/26
REVISED DATE :2006/03/13B
All Output Voltage Version Electrical Characteristics
Specifications in boldface type are for full operating temperature range. The other type are for TJ=25 к.
Parameter
Symbol
Conditions
Min
Typ
Feedback bias current
IFB VFB=1.3V (adjustable version only)
-
-10
Oscillator frequency
FOSC
127/110 150
Max
-50/-100
173/173
Oscillator frequency of
short circuit protect
FSCP
When current limit occurred and
VFB<0.5V, TA=25 к.
5
15
25
Saturation voltage
VSAT
ILOAD=3A No outside circuit
VFB=0V force drive on
-
1.4
1.6/1.7
Max. duty cycle (ON)
Max. duty cycle (OFF)
DC ^{VFB=0V force drive on}
VFB=12V force drive off
-
100
-
-
0
-
Current limit
ICL
Peak current No outside circuit
VFB=0V force drive on
3.6
4.5
5.5/6.5
Output leakage current
Output=0V, No outside circuit
IL VFB=12V force drive off
-
-
-200
Output=-1V, VIN=22V
-
-5
-
Quiescent current
IQ VFB=12V force drive off
-
5
10
ON/OFF pin logic input
Threshold Voltage
VIL Low (Regulator ON)
VIH High (Regulator OFF)
-
-
0.6
2.0
--
-
ON/OFF pin Logic input
current
IH VLOGIC=2.5V ( Regulator OFF)
-
-
-0.01
ON/OFF pin input
current
IL VLOGIC=0.5V ( Regulator ON)
-
Standby quiescent
current
ISTBY ON/OFF pin=5V, VIN=12V
-
JC Junction to Case
-
Thermal Resistance
JA
Junction to Ambient with copper
area of approximately 3 in²
-
-0.1
-1
150
200
2.5
-
28
-
Unless otherwise specified, VIN=12V for 3.3V, 5V, adjustable version and VIN=18V for the 12V version. ILOAD=0.5A
Unit
nA
kHz
kHz
V
%
A
uA
mA
mA
V
uA
uA
к/W
Function Description
The TO-220 package needs a heat sink under most conditions. The size of the heat sink depends on the input voltage, the output voltage,
the load current and the ambient temperature. The G5E2596M junction temperature rises above ambient temperature with a 3A load and
different input and output voltages. The data for these curves was taken with the G5E2596M operating as a buck-switching regulator in an
ambient temperature of 25к (still air). These temperature rise numbers are all approximate and there are many factors that can affect
these temperatures. Higher ambient temperatures require more heat sinking.
For the best thermal performance, wide copper traces and generous amounts of printed circuit board copper should be used in the board
layout. (One exception to this is the output (switch) pin, which should not have large areas of copper.) Large areas of copper provide the
best transfer of heat (lower thermal resistance) to the surrounding air, and moving air lowers the thermal resistance even further.
Package thermal resistance and junction temperature rise numbers are all approximate, and there are many factors will affect these
numbers. Some of these factors include board size, shape, thickness, position, location and even board temperature. Other factors are,
trace width, total printed circuit copper area, copper thickness, single or double-sided, multi-layer board and the amount of solder on the
board. The effectiveness of the PC board to dissipate heat also depends on the size, quantity and spacing of other components on the
board, as well as the surrounding air is still or moving. Furthermore, some of these components such as the catch diode will add heat to
the PC board and the heat can vary as the input voltage changes. For the inductor, depending on the physical size, type of core material
and the DC resistance, it could either act as a heat sink taking heat away from the board, or it could add heat to the board.
G5E2596M
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