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GM9452 Datasheet, PDF (2/4 Pages) GTM CORPORATION – N-CHANNEL ENHANCEMENT MODE POWER MOSFET
ISSUED DATE :2005/09/14
REVISED DATE :
Electrical Characteristics(Tj = 25ć Unless otherwise specified)
Parameter
Symbol Min. Typ. Max. Unit
Test Conditions
Drain-Source Breakdown Voltage
BVDSS
20
Breakdown Voltage Temperature Coefficient ϦBVDSS /ϦTj
-
Gate Threshold Voltage
Forward Transconductance2
VGS(th)
0.7
gfs
-
Gate-Source Leakage Current
IGSS
-
Drain-Source Leakage Current(Tj=25к)
-
IDSS
Drain-Source Leakage Current(Tj=70к)
-
-
0.03
-
10
-
-
-
-
-
1.5
-
̈́100
1
25
V VGS=0, ID=250uA
V/к Reference to 25к, ID=1mA
V VDS=VGS, ID=250uA
S VDS=5V, ID=3A
nA VGS= ̈́16V
uA VDS=20V, VGS=0
uA VDS=16V, VGS=0
-
Static Drain-Source On-Resistance2 RDS(ON)
-
Total Gate Charge2
Qg
-
Gate-Source Charge
Qgs
-
Gate-Drain (“Miller”) Change
Turn-on Delay Time2
Qgd
-
Td(on)
-
Rise Time
Tr
-
Turn-off Delay Time
Td(off)
-
Fall Time
Tf
-
Input Capacitance
Ciss
-
Output Capacitance
Coss
-
Reverse Transfer Capacitance
Crss
-
-
38
VGS=10V, ID=4A
mÓ¨
-
50
VGS=4.5V, ID=4A
6
10
ID=4A
1
-
nc VDS=16V
2
-
VGS=4.5V
8
-
VDS=10V
9
-
ID=1A
ns VGS=5V
13
-
RG=3.3Ó¨
3
-
RD=10Ó¨
360 570
80
-
65
-
VGS=0V
pF VDS=20V
f=1.0MHz
Source-Drain Diode
Parameter
Forward On Voltage2
Reverse Recovery Time2
Reverse Recovery Charge
Symbol
VSD
Trr
Qrr
Min.
-
-
-
Typ.
-
18
10
Max.
1.3
-
-
Unit
Test Conditions
V IS=1A, VGS=0V
ns IS=4A, VGS=0V
nC dI/dt=100A/ s
Notes: 1. Pulse width limited by safe operating area.
2. Pulse widthЉ300us, duty cycleЉ2%.
3. Surface mounted on FR4 board, t Љ10sec.
GM9452
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