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GS8182D18BGD-300I Datasheet, PDF (5/36 Pages) GSI Technology – JEDEC-standard pinout and package
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GS8182D08/09/18/36BD-400/375/333/300/250/200/167
2M x 8 SigmaQuad-II SRAM—Top View
1
2
3
4
5
6
7
8
9
10
11
A
CQ
NC/SA
(72Mb)
SA
W
NW1
K
NC/SA
(144Mb)
R
SA
NC/SA
(36Mb)
CQ
B
NC
NC
NC
SA
NC
K
NW0
SA
NC
NC
Q3
C
NC
NC
NC
VSS
SA
NC
SA
VSS
NC
NC
D3
D
NC
D4
NC
VSS
VSS
VSS
VSS
VSS
NC
NC
NC
E
NC
NC
Q4
VDDQ
VSS
VSS
VSS
VDDQ
NC
D2
Q2
F
NC
NC
NC
VDDQ
VDD
VSS
VDD
VDDQ
NC
NC
NC
G
NC
D5
Q5
VDDQ
VDD
VSS
VDD
VDDQ
NC
NC
NC
H
Doff
VREF
VDDQ
VDDQ
VDD
VSS
VDD
VDDQ
VDDQ
VREF
ZQ
J
NC
NC
NC
VDDQ
VDD
VSS
VDD
VDDQ
NC
Q1
D1
K
NC
NC
NC
VDDQ
VDD
VSS
VDD
VDDQ
NC
NC
NC
L
NC
Q6
D6
VDDQ
VSS
VSS
VSS
VDDQ
NC
NC
Q0
M
NC
NC
NC
VSS
VSS
VSS
VSS
VSS
NC
NC
D0
N
NC
D7
NC
VSS
SA
SA
SA
VSS
NC
NC
NC
P
NC
NC
Q7
SA
SA
C
SA
SA
NC
NC
NC
R
TDO
TCK
SA
SA
SA
C
SA
SA
SA
TMS
TDI
11 x 15 Bump BGA—13 x 15 mm2 Body—1 mm Bump Pitch
Rev: 1.03d 11/2011
5/36
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2007, GSI Technology
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