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GS81314LD18GK-106I Datasheet, PDF (38/40 Pages) GSI Technology – Burst of 4 Multi-Bank ECCRAM | |||
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GS81314LD18/36GK-133/120/106
260-Pin BGA Package Drawing (Package GK)
Ã0.08 S C
Ã0.22 S C A S B S
PIN #1 CORNER
Ã0.50~Ã0.70(260x)
13 12 11 10 9 8 7 6 5 4 3 2 1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
B
A
0.05(4X)
13.20 ï± 0.05
14.00 ï± 0.05
1.00
12.00
HEAT SPREADER
4âR0.5 (MAX)
C SEATING PLANE
Ball Pitch:
Ball Diameter:
1.00 Substrate Thickness: 0.51
0.60 Mold Thickness:
â
Rev: 1.09 5/2016
38/40
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2014, GSI Technology
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