GS8673ED18BGK-550 Datasheet, PDF (29/31 Pages) GSI Technology – On-Chip ECC with virtually zero SER

GS8673ED18/36BK-675/625/550/500
260-Pin BGA Package Drawing (Package K)
PIN #1 CORNER
B
A
0.05(4X)
12.60 ± 0.05
14.00 ± 0.05
Ø0.08 S C
Ø0.08 S C A S B S
Ø0.50~Ø0.70(260x)
13 12 11 10 9 8 7 6 5 4 3 2 1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
1.00
12.00
HEAT SPREADER
4–R0.5 (MAX)
C SEATING PLANE
Ball Pitch:
Ball Diameter:
1.00 Substrate Thickness: 0.51
0.60 Mold Thickness:
—
Rev: 1.06 5/2012
29/31
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2011, GSI Technology