GS82583ED18 Datasheet, PDF (24/26 Pages) GSI Technology – 288Mb SigmaQuad-IIIe™ Burst of 4 SRAM

GS82583ED18/36GK-675/625/550/500
260-Pin BGA Package Drawing (Package GK)
Ø0.08 S C
Ø0.22 S C A S B S
PIN #1 CORNER
Ø0.50~Ø0.70(260x)
13 12 11 10 9 8 7 6 5 4 3 2 1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
B
A
0.05(4X)
13.20  0.05
14.00  0.05
1.00
12.00
HEAT SPREADER
4–R0.5 (MAX)
C SEATING PLANE
Ball Pitch:
Ball Diameter:
1.00 Substrate Thickness: 0.51
0.60 Mold Thickness:
—
Rev: 1.05 8/2016
24/26
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2014, GSI Technology