SGC2550S_15 Datasheet, PDF (1/4 Pages) GOOD-ARK Electronics – Surface Mount Schottky Rectifier Reverse Voltage 50~60V Forward Current 25A

SGC2550S thru SGC2560S
Surface Mount Schottky Rectifier
Reverse Voltage 50~60V Forward Current 25A
Features
• Heatsink design
• Schottky barrier diodes
• Low forward voltage drop
• Solder dip 260 °C, 10 s
• Low profile - typical height of 1.1 mm
• Moisture sensitivity: level 1, per J-STD-020
• High temperature soldering guaranteed: 260℃/10 seconds
• Halogen-free according to IEC 61249-2-21 definition
eSGC (TO‐277)
Cathode
& Heatsink
Anode 1
Anode 2
Typical Applications
For low voltage high frequency inverters, DC/DC converters and polarity protection application.
Maximum Ratings (TA = 25 °C unless otherwise noted)
Parameter
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current
Symbol
VRRM
VRMS
VDC
IF(AV)
SGC2550S
SGC2560S
Unit
50
60
V
35
42
V
50
60
V
25.0
A
Peak forward surge current 8.3 ms single
half sine-wave superimposed on rated load
IFSM
350
Operating junction and storage temperature
range
TJ, TSTG
-55 to +150
Electrical Characteristics (TA = 25 °C unless otherwise noted)
Parameter
Test Conditions
Symbol
Typ
Max
I_F=1A
0.29
-
I_F=3A
0.33
-
I_F=5A
T_A=25℃
0.35
0.40
I_F=10A
0.39
-
Instantaneous forward voltage
I_F=25A
I_F=1A
0.48
0.60
V_F
0.15
-
I_F=3A
0.20
0.25
I_F=5A
T_A=125℃
0.24
0.30
I_F=10A
0.30
-
I_F=25A
0.45
0.50
Reverse current
Rated VR
T_A=25℃
T_A=100℃
I_R
0.085
18
0.5
100
Typical junction capacitance
4.0 V, 1 MHz
C_J
2.0
Typical thermal resistance
juntion to mount
R_θJM1)
1.0
Note1)Thermal resistance R_θJM is junction to mount,Mounted on Al P.C.B with recommended copper pad area
A
°C
Unit
Volts
mA
nF
℃/W
www.goodark.com
1/4
2015.03-Rev.A