SGC12BS_15 Datasheet, PDF (1/4 Pages) GOOD-ARK Electronics – Surface Mount Schottky Rectifier Reverse Voltage 100V Forward Current 12A

SGC12BS
Surface Mount Schottky Rectifier
Reverse Voltage 100V Forward Current 12A
Features
• Schottky barrier diodes
• Low forward voltage drop
• Low leakage current
• Moisture sensitivity: level 1, per J-STD-020
• Solder dip 260 °C, 10 s
• Low profile - typical height of 1.1 mm
• Heatsink design
Cathode
& Heatsink
• High temperature soldering guaranteed: 260℃/10 seconds
• Halogen-free according to IEC 61249-2-21 definition
Typical Applications
eSGC (TO‐277)
Anode 1
Anode 2
For low voltage high frequency inverters, DC/DC converters and polarity protection application.
Maximum Ratings (TA = 25 °C unless otherwise noted)
Parameter
Symbol
SGC12BS
Maximum repetitive peak reverse voltage
VRRM
100
Maximum RMS voltage
VRMS
70
Maximum DC blocking voltage
VDC
100
Maximum average forward rectified current
IF(AV)¹⁾
IF(AV)²⁾
5.0
12.0
Peak forward surge current 8.3 ms single half
sine-wave superimposed on rated load
IFSM
240
Operating junction and storage temperature
range
TJ, TSTG
-55 to +150
Electrical Characteristics (TA = 25 °C unless otherwise noted)
Parameter
Test Conditions Symbol
TYP.
MAX.
Maximum instantaneous forward voltage
I_F=5A
I_F=12A
I_F=5A
I_F=12A
T_A=25℃
T_A=125℃
V_F
0.47
0.57
0.39
0.53
Maximum DC reverse current at rated DC
VR=80V
T_A=25℃
T_A=125℃
I_R
blocking voltage
VR=100V
T_A=25℃
T_A=125℃
I_R
14.9
9.6
29.5
15.2
Typical junction capacitance
4.0 V, 1 MHz
C_J
290
Typical thermal resistance
juntion to ambient
R_θJA ¹⁾
75
juntion to mount
R_θJM ²⁾
1
Notes,1)Thermal resistance R_θJA is junction to ambient. Free air,mounted on P.C.B with recommended copper pad area,2 OZ,FR4
2)Thermal resistance R_θJM is junction to mount.Mounted on P.C.B with 30*30mm copper pad area
-
0.70
-
0.65
-
-
250
30
Unit
V
V
V
A
A
°C
Unit
Volts
uA
mA
uA
mA
pF
℃/W
℃/W
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2014.03-Rev.A