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SGC101BSA_15 Datasheet, PDF (1/4 Pages) GOOD-ARK Electronics – Surface Mount Schottky Rectifier Reverse Voltage 100V Forward Current 10A
SGC101BSA
Surface Mount Schottky Rectifier
Reverse Voltage 100V Forward Current 10A
Features
• Schottky barrier diodes
• Low forward voltage drop
• Low leakage current
• Moisture sensitivity: level 1, per J-STD-020
• Solder dip 260 °C, 10 s
• Low profile - typical height of 1.1 mm
• Heatsink design
• High temperature soldering guaranteed: 260℃/10 seconds
• Halogen-free according to IEC 61249-2-21 definition
Typical Applications
Cathode
& Heatsink
eSGC (TO‐277)
Anode 1
Anode 2
For low voltage high frequency inverters, DC/DC converters and polarity protection application.
Maximum Ratings (TA = 25 °C unless otherwise noted)
Parameter
Symbol
SGC101BSA
Maximum repetitive peak reverse voltage
VRRM
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current
Peak forward surge current 8.3 ms single
half sine-wave superimposed on rated load
Operating junction and storage temperature
range
VRMS
VDC
IF(AV)1)
IF(AV)2)
IFSM
TJ, TSTG
100
70
100
5.0
10.0
220
-55 to +150
Electrical Characteristics (TA = 25 °C unless otherwise noted)
Parameter
Test Conditions Symbol
TYP.
IF=1A
0.38
Instantaneous forward voltage
IF=2A
IF=10A
TA=25℃
VF
0.41
0.54
IF=10A
TA=125℃
0.50
Instantaneous reverse current
VR=80V
TA=25℃
VR=100V
TA=125℃
TA=25℃
IR
TA=125℃
14.9
9.6
29.5
15.2
Typical junction capacitance
4.0 V, 1 MHz
CJ
290
Typical thermal resistance
juntion to ambient
RθJA 1)
75
juntion to mount
RθJM 2)
1
Notes1)Thermal resistance RθJA is junction to ambient. Free air,mounted on P.C.B with recommended copper pad area,2 OZ,FR4
2)Thermal resistance RθJM is junction to mount.Mounted on P.C.B with 30*30mm copper pad area
MAX.
-
-
0.65
0.60
-
-
500
50
Unit
V
V
V
A
A
°C
Unit
Volts
uA
mA
uA
mA
pF
℃/W
℃/W
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2014.03-Rev.A