S1206S_15 Datasheet, PDF (1/4 Pages) GOOD-ARK Electronics – Chip Fuse

Chip Fuse
Description
■ High inrush current withstanding capability
■ Compatible with reflow and wave solder
■ Rugged ceramic and glass construction
■ Excellent environmental performance
■ RoHS Compliant ,Lead Free & Halogen Free
material
Applications
■ Telecommunication: PDA / DSL
■ Computers: LCD Panel / Printers/ Laptop/
Servers
■ Consumer Electronics: DVD player / MP3
MP4 Player
S1206S Series
Sn PLATING
OVERCOAT
CERAMIC SUBSTRATE
FUSE ELEMENT Cu / Ni PLATING
Environmental Data
■ Life Test: MIL-STD-202, Method 108D
■ Humidity Bias: MIL-STD-202 , Method 103
■ Moisture Resistance Test: MIL-STD-202, Method 106G
■ Thermal Shock: MIL-STD-202, Method 107G
■ Terminal Strength: AEC-Q200-006
■ Board Flex: AEC-Q200-005 Appendix 2 Note: 1mm (Min)
■ Vibration: MIL-STD-202, Method 204C
■ Mechanical Shock:MIL-STD-202,Method 213C
■ Solderability: ANSI/J-STD-202
■ Resistance to Solder Heat: MIL-STD-202,Method 210B
■ Resistance to Solvents Test: MIL-STD-202, Method 215
Electrical Characteristics
Ampere Rating
1A-7A
1A-7A
1A-7A
1A-7A
% of Amp Rating
100%
200%
300%
800%
Opening Time
4 Hours Minimum
1~120 Senconds
0.1~3 Senconds
0.002～0.05 Seconds
Electrical Specifications
Product
Code
Current
Rating
Voltage Interruptin Resistance
Rating g Rating* (ohms)**
DC
Typ.
Typical
Melt I²t ***
(A²s)
Alpha
Code Marking
S1206S1
1A
63V
50A
0.42
0.10
H
1
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