S1206H Datasheet, PDF (1/4 Pages) GOOD-ARK Electronics – Chip Fuse

Chip Fuse
Description
■ High inrush current withstanding capability
■ Compatible with reflow and wave solder
■ Rugged ceramic and glass construction
■ Excellent environmental performance
■ RoHS Compliant ,Lead Free & Halogen Free
material
Applications
■ Telecommunication: PDA / DSL
■ Computers: LCD Panel / Printers/ Laptop/
Servers
■ Consumer Electronics: DVD player / MP3
MP4 Player
S1206H Series
Sn PLATING
OVERCOAT
CERAMIC SUBSTRATE
FUSE ELEMENT Cu / Ni PLATING
Environmental Data
■ Life Test: MIL-STD-202, Method 108D
■ Humidity Bias: MIL-STD-202 , Method 103
■ Moisture Resistance Test: MIL-STD-202, Method 106G
■ Thermal Shock: MIL-STD-202, Method 107G
■ Terminal Strength: AEC-Q200-006
■ Board Flex: AEC-Q200-005 Appendix 2 Note: 1mm (Min)
■ Vibration: MIL-STD-202, Method 204C
■ Mechanical Shock:MIL-STD-202,Method 213C
■ Solderability: ANSI/J-STD-202
■ Resistance to Solder Heat: MIL-STD-202,Method 210B
Electrical Characteristics
Ampere Rating
1A-7A
1A-7A
1A-7A
% of Amp Rating
100%
200%
1000%
Opening Time
4 Hours Minimum
1~60 Senconds
0.0002～0.02Seconds
Product
Code
Current
Rating
S1206H1
1A
S1206H1.25 1.25A
S1206H1.5 1.5A
Voltage
Rating
DC
63V
63V
63V
Electrical Specifications
Interrupting Resistance
Rating*
(ohms)**
Typ.
50A
0.41
50A
0.25
50A
0.2
@copyright Good-Ark2012
Typical
Melt I²t ***
(A²s)
0.10
0.22
0.26
Alpha
Code
Marking
H
J
K
1
www.goodark.com