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S0603F_15 Datasheet, PDF (1/4 Pages) GOOD-ARK Electronics – Chip Fuse
Chip Fuse
Description
■ Fast acting for excessive current
■ Compatible with reflow and wave solder
■ Rugged ceramic and glass construction
■ Excellent environmental performance
■ RoHS Compliant ,Lead Free & Halogen Free
material
Applications
■ Telecommunication: PDA / DSL/ Cell Phones
■ Computers: LCD Panel / Printers/ Laptop/
Servers
■ Consumer Electronics: DVD player / MP3
MP4 Player
S0603F Series
Sn PLATING
OVERCOAT
CERAMIC SUBSTRATE
FUSE ELEMENT Cu / Ni PLATING
Environmental Data
■ Life Test: MIL-STD-202, Method 108A
■ Humidity Bias: MIL-STD-202 , Method 103
■ Moisture Resistance Test: MIL-STD-202, Method 106G
■ Thermal Shock: MIL-STD-202, Method 107G
■ Terminal Strength: AEC-Q200-006
■ Board Flex: AEC-Q200-005 Appendix 2 Note: 1mm (Min)
■ Vibration: MIL-STD-202, Method 204D
■ Mechanical Shock:MIL-STD-202,Method 213B
■ Solderability: MIL-STD-202 Method 208H
■ Resistance to Solder Heat: MIL-STD-202,Method 210A
Electrical Characteristics
Ampere Rating
250mA-6A
250mA-6A
% of Amp Rating
100%
Opening Time
4 Hours Minimum
250%
5 Seconds Maximum
Product
Code
S0603F250
S0603F375
S0603F500
Current
Rating
Electrical Specifications
Voltage Interrupting Resistance
Rating Rating*
(ohms)**
AC DC AC/DC
Typ.
250mA 32V 32V
50A
5.1
375mA 32V 32V
50A
2.4
500mA 32V 32V
50A
1.1
@copyright Good-Ark2012
Typical
Melt I2t ***
DC (A2s)
0.0004
0.0009
0.0018
Typical
Voltage
Drop
(V)****
1.3
0.93
0.66
Alpha
Code
Marking
*****
D
E
F
1
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