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S0402F_15 Datasheet, PDF (1/3 Pages) GOOD-ARK Electronics – Chip Fuse | |||
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Chip Fuse
Description
â Fast acting for excessive current
â Compatible with reflow and wave solder
â Rugged ceramic and glass construction
â Excellent environmental performance
â RoHS Compliant ,Lead Free & Halogen Free
material
Applications
â Telecommunication: PDA / DSL/ Cell Phones
â Computers: LCD Panel / Printers/ Laptop/
Servers
â Consumer Electronics: DVD player / MP3
MP4 Player
S0402F Series
Sn PLATING
OVERCOAT
CERAMIC SUBSTRATE
FUSE ELEMENT Cu / Ni PLATING
Environmental Data
â Life Test: 30°C ±2°C ,75% rated current, 1000 hours,
â Humidity Bias: MIL-STD-202 , Method 103
â Moisture Resistance Test: MIL-STD-202, Method 106G
â Thermal Shock: MIL-STD-202, Method 107G
â Terminal Strength: AEC-Q200-006
â Board Flex: AEC-Q200-005 Appendix 2 Note: 1mm (Min)
â Vibration: MIL-STD-202, Method 204C
â MechanicalShock:MIL-STD-202,Method 213C
â Solderability: MIL-STD-202 Method 208H
â Resistance to Solder Heat: MIL-STD-202,Method 210A
Electrical Characteristics
Ampere Rating
200mA-4A
200mA-4A
% of Amp Rating
100%
Opening Time
4 Hours Minimum
250%
5 Seconds Maximum
Electrical Specifications
Product
Code
Current
Rating
Voltage Rating
DC
Interrupting
Rating*
DC
Resistance
(ohms)**
Typ.
Typical
Melt I²t ***
DC (A²s)
S0402F200 200mA
24V
35A
4.300
0.0008
S0402F250 250mA
24V
35A
3.200
0.0011
S0402F375 375mA
24V
35A
1.140
0.0021
S0402F500 500mA
24V
35A
1.200
0.0043
1
@copyright Good-Ark2012
www.goodark.com
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