S0402F Datasheet, PDF (1/3 Pages) GOOD-ARK Electronics – Chip Fuse

Chip Fuse
Description
■ Fast acting for excessive current
■ Compatible with reflow and wave solder
■ Rugged ceramic and glass construction
■ Excellent environmental performance
■ RoHS Compliant ,Lead Free & Halogen Free
material
Applications
■ Telecommunication: PDA / DSL/ Cell Phones
■ Computers: LCD Panel / Printers/ Laptop/
Servers
■ Consumer Electronics: DVD player / MP3
MP4 Player
S0402F Series
Sn PLATING
OVERCOAT
CERAMIC SUBSTRATE
FUSE ELEMENT Cu / Ni PLATING
Environmental Data
■ Life Test: 30°C ±2°C ,75% rated current, 1000 hours,
■ Humidity Bias: MIL-STD-202 , Method 103
■ Moisture Resistance Test: MIL-STD-202, Method 106G
■ Thermal Shock: MIL-STD-202, Method 107G
■ Terminal Strength: AEC-Q200-006
■ Board Flex: AEC-Q200-005 Appendix 2 Note: 1mm (Min)
■ Vibration: MIL-STD-202, Method 204C
■ MechanicalShock:MIL-STD-202,Method 213C
■ Solderability: MIL-STD-202 Method 208H
■ Resistance to Solder Heat: MIL-STD-202,Method 210A
Electrical Characteristics
Ampere Rating
200mA-4A
200mA-4A
% of Amp Rating
100%
Opening Time
4 Hours Minimum
250%
5 Seconds Maximum
Electrical Specifications
Product
Code
Current
Rating
Voltage Rating
DC
Interrupting
Rating*
DC
Resistance
(ohms)**
Typ.
Typical
Melt I²t ***
DC (A²s)
S0402F200 200mA
24V
35A
4.300
0.0008
S0402F250 250mA
24V
35A
3.200
0.0011
S0402F375 375mA
24V
35A
1.140
0.0021
S0402F500 500mA
24V
35A
1.200
0.0043
1
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