RMB2S_15 Datasheet, PDF(1/2 Page) GOOD-ARK Electronics – Miniature Glass Passivated Fast Recovery Surface Mount Bridge Rectifiers Reverse Voltage 200 to 400 Volts Forward Current 0.5 Ampere

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RMB2S_15 Datasheet, PDF (1/2 Pages) GOOD-ARK Electronics – Miniature Glass Passivated Fast Recovery Surface Mount Bridge Rectifiers Reverse Voltage 200 to 400 Volts Forward Current 0.5 Ampere

RMB2S thru RMB4S

Miniature Glass Passivated Fast Recovery Surface Mount Bridge Rectifiers

Reverse Voltage 200 to 400 Volts Forward Current 0.5 Ampere

Features

Plastic package has UL Flammability Classification 94V-0

Glass passivated chip junctions

Saves space on printed circuit boards

Fast recovery, low switching loss

High temperature soldering guaranteed:

260oC/10 seconds at 5 lbs. (2.3kg) tension

Mechanical Data

Case: Molded plastic body over passivated junctions

Terminals: Plated leads solderable per MIL-STD-750,

Method 2026

Polarity: Polarity symbols marked on body

Mounting Position: Any

Weight: 0.078 oz, 0.22g

Package outline dimensions in inches (millimeters)

Maximum Ratings and Electrical Characteristics

(TA=25oC unless otherwise noted)

Parameter

Symbols

RMB2S

RMB4S

Units

Maximum repetitive peak reverse voltag

Maximum RMS voltage

Maximum DC blocking voltage

Maximum average forward output rectified

current at TA=30oC

on glass-epoxy P.C.B.

on aluminum substrate

Peak forward surge current 8.3 ms single half sine-wave

superimposed on rated load (JEDEC Method)

RRM

VRMS

VDC

IF(AV)

IFSM

200

400

140

280

200

400

0.5 (1)

0.8 (2)

30.0

Volts

Amp

Amps

Rating for fusing (t < 8.3ms)

I2t

5.0

A2sec

Maximum instantaneous forward voltage drop per leg at 0.4A

Maximum DC reverse current at TA = 25oC

rated DC blocking voltage per leg TA = 125oC

Maximum reverse recovery time at IF=0.5A, IR=1.0A, Irr=0.25A

trr

RÎ¸JA

Typical thermal resistance per leg

RÎ¸JA

RÎ¸JL

Typical junction capacitance per leg at 4.0V, 1.0MHz

1.0

5.0

100

150

85 (1)

70 (2)

20 (1)

Volt

oC/W

Operating junction and storage temperature range

TJ, TSTG

-55 to +150

Notes: 1. On glass epoxy P.C.B. mounted on 0.05 x 0.05" (1.3 x 1.3mm) pads

2. On aluminum substrate P.C.B. with an area of 0.8 x 0.8" (20 x 20mm) mounted on 0.05 x 0.05" (1.3 x 1.3mm) solder pad

409

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