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PS32 Datasheet, PDF (1/4 Pages) GOOD-ARK Electronics – Surface Mount Schottky Rectifier
PS32 thru PS345
Surface Mount Schottky Rectifier
Reverse Voltage 20~45V Forward Current 3.0A
Features
• Heatsink structure
• Low profile, typical thickness 0.8mm
• Super Low VF Schottky barrier diodes
• Moisture sensitivity: level 1, per J-STD-020
• High temperature soldering guaranteed: 260℃/10 seconds
iSGA
(SOD-123HS)
Typical Applications
For use of fast swiching in RF module, lighting, cellular phone, portable device, power supplies
and other consumer applications.
Maximum Ratings (TA = 25 °C unless otherwise noted)
Parameter
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current
Peak forward surge current 8.3 ms single half sine-
wave superimposed on rated load
Rating for fusing(t<8.3ms)
Operating junction temperature range
Storage temperature range
Symbol
VRRM
VRMS
VDC
IF(AV)
IFSM
I2t
TJ
TSTG
PS32
20
14
20
PS33
PS34
30
40
21
28
30
40
3.0
100
42
- 55 to + 150
- 55 to + 150
PS345
45
31.5
45
Unit
V
V
V
A
A
A2sec
°C
°C
Electrical Characteristics (TA = 25 °C unless otherwise noted)
Parameter
Test Conditions Symbol PS32
PS33
PS34
Minimum Breakdown voltage Ta=25℃,IR=1mA
VBR
45
Maximum instantaneous
forward voltage
IF=3A,Ta=25℃
IF=3A,Ta=125℃
VF
0.51
0.45
Maximum DC reverse current Ta=25℃
at rated DC blocking voltage Ta=125℃
IR
50
10
Typical junction capacitance 4.0 V, 1 MHz
CJ
229
Typical thermal resistance
juntion to ambient
RθJA1)
60
juntion to lead
RθJL1)
6
juntion to case
RθJC2)
28
Note:1),The thermal resistance from junction to ambient or lead, mounted on P.C.B with 5×5mm copper pads,2 OZ,FR4 PCB
2),The thermal resistance from junction to case, mounted on P.C.B with recommended copper pads,2 OZ,FR4 PCB
PS345 Unit
Volts
uA
mA
pF
℃/W
www.goodark.com
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2016.05-Rev.A