PS22 Datasheet, PDF (1/4 Pages) GOOD-ARK Electronics – Surface Mount Schottky Rectifier

PS22 thru PS24
Surface Mount Schottky Rectifier
Reverse Voltage 20~40V Forward Current 2A
Features
• Heatsink structure
• Low profile, typical thickness 0.8mm
• Super Low VF Schottky barrier diodes
• Moisture sensitivity: level 1, per J-STD-020
• High temperature soldering guaranteed: 260℃/10 seconds
iSGA
(SOD-123HS)
Typical Applications
For use of fast swiching in RF module, lighting, cellular phone, portable device, power supplies
and other consumer applications.
Maximum Ratings (TA = 25 °C unless otherwise noted)
Parameter
Symbol
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current
Peak forward surge current 8.3 ms single half sine-
wave superimposed on rated load
Rating for fusing(t＜8.3ms)
Operating junction temperature range
Storage temperature range
VRRM
VRMS
VDC
IF(AV)
IFSM
I²t
T_J
T_STG
PS22
20
14
20
PS23
30
21
30
2.0
50
10
- 55 to + 150
- 55 to + 150
PS24
40
28
40
Electrical Characteristics (TA = 25 °C unless otherwise noted)
Parameter
Test Conditions Symbol
PS22
PS23
PS24
Minimum Breakdown voltage Ta=25℃,IR=1mA
V_BR
20
30
40
Maximum instantaneous
IF=2A,Ta=25℃
V_F
0.51
forward voltage
IF=2A,Ta=125℃
V_F
0.45
Maximum DC reverse current Ta=25℃
at rated DC blocking voltage _Ta=125℃
I_R
50
10
Typical junction capacitance 4.0 V, 1 MHz
C_J
115
Typical thermal resistance
juntion to ambient R_θJA¹⁾
60
juntion to lead
R_θJL¹⁾
6
juntion to case
R_θJC²⁾
28
Note:1),The thermal resistance from junction to ambient or lead, mounted on P.C.B with 5×5mm copper pads,2 OZ,FR4 PCB
2),The thermal resistance from junction to case, mounted on P.C.B with recommended copper pads,2 OZ,FR4 PCB
Unit
V
V
V
A
A
A²sec
°C
°C
Unit
Volts
uA
mA
pF
℃/W
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2016.04-Rev.A