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PF151 Datasheet, PDF (1/4 Pages) GOOD-ARK Electronics – Surface Mount Glass Passivated Fast Recovery Rectifier
PF151 thru PF157
Surface Mount Glass Passivated Fast Recovery Rectifier
Reverse Voltage 50~1000V Forward Current 1.5A
Features
• Glass passivated fast recovery rectifiers
• Heatsink structure
• Low profile, typical thickness 0.8mm
• Low forward voltage drop
• Low leakage current
• Moisture sensitivity: level 1, per J-STD-020
• Solder dip 260 °C, 10 s
iSGA
(SOD-123HS)
Typical Applications
For use of general purpose rectification in lighting, cellular phone, portable device, power
supplies and other consumer applications.
Maximum Ratings (TA = 25 °C unless otherwise noted)
Parameter
Symbol PF151 PF152 PF153 PF154 PF155 PF156 PF157 Unit
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current
VRRM 50 100 200 400 600 800 1000 V
VRMS 35 70 140 280 420 560 700 V
VDC 50 100 200 400 600 800 1000 V
IF(AV)
1.5
A
Peak forward surge current 8.3 ms single half
sine-wave superimposed on rated load
IFSM
52
A
Rating for fusing(t<8.3ms)
I2t
11.3
A2sec
Operating junction and storage temperature range TJ,
TSTG
- 55 to + 150
°C
Electrical Characteristics (TA = 25 °C unless otherwise noted)
Parameter
Test Conditions Symbol PF151 PF152 PF153 PF154 PF155 PF156 PF157 Unit
Minimum Breakdown voltage Ta=25℃,IR=100uA VBR
400
600
1000
Maximum instantaneous
forward voltage
IF=1.5 A,TA=25℃
VF
1.3
Maximum DC reverse current TA=25℃
at rated DC blocking voltage TA=125℃
IR
5.0
100
Maximum reverse recovery IF=0.5A,IR=1.0A,
time
Irr=0.25A
trr
150
250
Typical junction capacitance 4.0 V, 1 MHz
CJ
7.5
juntion to ambient
RθJA1)
60
Typical thermal resistance juntion to lead
RθJL1)
10
juntion to case
RθJC2)
35
Note:1),The thermal resistance from junction to ambient or lead, mounted on P.C.B with 5×5mm copper pads,2 OZ,FR4 PCB
2),The thermal resistance from junction to case, mounted on P.C.B with recommended copper pads,2 OZ,FR4 PCB
V
µA
nS
pF
℃/W
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2016.05-Rev.A