PF1 Datasheet, PDF (1/4 Pages) GOOD-ARK Electronics – Surface Mount Glass Passivated Fast Recovery Rectifier

PF1 thru PF7
Surface Mount Glass Passivated Fast Recovery Rectifier
Reverse Voltage 50~1000V Forward Current 1A
Features
• Glass passivated fast recovery rectifiers
• Heatsink structure
• Low profile, typical thickness 0.8mm
• Low forward voltage drop
• Low leakage current
• Moisture sensitivity: level 1, per J-STD-020
• Solder dip 260 °C, 10 s
Typical Applications
iSGA
(SOD-123HS)
For use of general purpose rectification in lighting, cellular phone, portable device, power supplies,
and other consumer applications.
Maximum Ratings (TA = 25 °C unless otherwise noted)
Parameter
Symbol PF1 PF2 PF3 PF4 PF5 PF6 PF7 Unit
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current
Peak forward surge current 8.3 ms single half
sine-wave superimposed on rated load
Rating for fusing(t＜8.3ms)
Operating junction and storage temperature range
VRRM
VRMS
VDC
IF(AV)
IFSM
I²t
TJ,
TSTG
50 100 200 400 600 800 1000 V
35 70 140 280 420 560 700 V
50 100 200 400 600 800 1000 V
1.0
A
30
A
3.8
A²sec
- 55 to + 150
°C
Electrical Characteristics (TA = 25 °C unless otherwise noted)
Parameter
Test Conditions Symbol PF1 PF2 PF3 PF4 PF5 PF6 PF7 Unit
Minimum Breakdown voltage Ta=25℃,IR=100uA
V_BR
Maximum instantaneous
forward voltage
IF=1 A,Ta=25℃
IF=1 A,Ta=125℃
V_F
400
600 1000
1.3
0.98
Maximum DC reverse current TA=25℃
at rated DC blocking voltage _TA=125℃
I_R
5.0
50
Maximum reverse recovery
time
I_F=0.5A,I_R=1.0A,
I_rr=0.25A
t_rr
150
250
Typical junction capacitance 4.0 V, 1 MHz
C_J
7.5
juntion to ambient
R_θJA¹⁾
63
Typical thermal resistance juntion to lead
R_θJL¹⁾
9
juntion to case
R_θJC²⁾
39
Note:1),The thermal resistance from junction to ambient or lead, mounted on P.C.B with 5×5mm copper pads,2 OZ,FR4 PCB
2),The thermal resistance from junction to case, mounted on P.C.B with recommended copper pads,2 OZ,FR4 PCB
V
µA
nS
pF
℃/W
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2016.03-Rev.A