MB2M Datasheet, PDF (1/2 Pages) General Semiconductor – MINIATURE GLASS PASSIVATED SINGLE-PHASE BRIDGE RECTIFIER

MB2M thru MB10M
Miniature Glass Passivated Single-Phase Bridge Rectifiers
Reverse Voltage 200 to 1000 Volts Forward Current 0.5 Ampere
Features
Plastic package has Underwriters Laboratory Flammability
Classification 94V-0
Glass passivated chip junctions
High surge overload rating: 35A peak
Saves space on printed circuit boards
Recommended for non-automotive applications
Mechanical Data
Case: Molded plastic body over passivated junctions
Terminals: Plated leads solderable per MIL-STD-750,
Method 2026
Mounting Position: Any
Weight: 0.078 oz., 0.22 g
Maximum Ratings and Electrical Characteristics
(T_A=25^oC unless otherwise noted)
Parameter
Symbols MB2M
MB4M
MB6M
MB8M MB10M
Units
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward output rectified current
(see Fig.1)
on glass-epoxy P.C.B.
on aluminum substrate
Peak forward surge current 8.3 ms single half sine-wave
superimposed on rated load (JEDEC Method)
Rating for fusing (t < 8.3ms)
V_RRM
V_RMS
V_DC
I_F(AV)
I_FSM
I²t
200
400
600
800
1000
140
280
420
560
700
200
400
600
800
1000
0.5 ⁽¹⁾
0.8 ⁽²⁾
35.0
5.0
Maximum instantaneous forward voltage drop per leg at 0.4A
V_F
Maximum DC reverse current at
rated DC blocking voltage per leg
T_A = 25^oC
T_A = 125^oC
I_R
R_θJA
Typical thermal resistance per leg
R_θJA
R_θJL
Typical junction capacitance per leg ⁽³⁾
C_J
1.0
5.0
100
85 ⁽¹⁾
70 ⁽²⁾
20 ⁽¹⁾
13
Operating junction and storage temperature range
T_J, T_STG
-55 to +150
Notes:
1. On glass epoxy P.C.B. mounted on 0.05 x 0.05" (1.3 x 1.3mm) pads
2. On aluminum substrate P.C.B. with an area of 0.8" x 0.8" (20 x 20mm) mounted on 0.05 x 0.05" (1.3 x 1.3mm) solder pad
3. Measured at 1.0 MHz and applied reverse voltage of 4.0 Volts
Volts
Volts
Volts
Amp
Amps
A²sec
Volt
uA
o_C/W
pF
o_C
407