LF1_15 Datasheet, PDF (1/4 Pages) GOOD-ARK Electronics – Surface Mount Glass Passivated Fast Recovery Rectifier Reverse Voltage 50~1000V Forward Current 1A

LF1 thru LF7
Surface Mount Glass Passivated Fast Recovery Rectifier
Reverse Voltage 50~1000V Forward Current 1A
Features
• Glass passivated fast recovery rectifiers
• Ideal for automated placement
• Low forward voltage drop
• Low leakage current
• Moisture sensitivity: level 1, per J-STD-020
• Solder dip 260 °C, 10 s
• Low profile， typical thickness 1.0mm
• AEC-Q101 qualified
Typical Applications
eSGB (SMAF)
For use of general purpose rectification in lighting, cellular phone, portable device,
power supplies, and other consumer applications.
Maximum Ratings (TA = 25 °C unless otherwise noted)
Parameter
Symbol LF1 LF2 LF3 LF4 LF5 LF6 LF7 Unit
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current
Peak forward surge current 8.3 ms single half
sine-wave superimposed on rated load
Rating for fusing(t＜8.3ms)
Operating junction and storage temperature
range
VRRM
VRMS
VDC
IF(AV)
IFSM
I²t
TJ,
TSTG
50 100 200 400 600 800 1000 V
35 70 140 280 420 560 700 V
50 100 200 400 600 800 1000 V
1.0
A
30
A
3.7
A²sec
- 55 to + 150
°C
Electrical Characteristics (TA = 25 °C unless otherwise noted)
Parameter
Test Conditions Symbol LF1 LF2 LF3 LF4 LF5 LF6 LF7 Unit
Maximum instantaneous
forward voltage
IF=1 A,TA=25℃ V_F
1.3
Maximum DC reverse current TA=25℃
at rated DC blocking voltage _TA=125℃
I_R
5
50
Maximum reverse recovery
time
I_F=0.5A,I_R=1.0A,
I_rr=0.25A
t_rr
150
250
500
Typical junction capacitance 4.0 V, 1 MHz
C_J
11
Typical thermal resistance^{1) juntion to case}
R_θJC
45
juntion to mount R_θJM
12
Note:1),The thermal resistance from junction to case and mount,mounted on P.C.B with 8×8mm copper pads,2 OZ,FR4 PCB
V
µA
nS
pF
℃/W
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2014.08-Rev.B