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GBJL35J_15 Datasheet, PDF (1/2 Pages) GOOD-ARK Electronics – Glass Passivated Single-Phase Bridge Rectifier Reverse Voltage - 600V to 1000V Forward Current - 35.0 Amperes
Features
◆ Thin Single In-Line package;
◆ Ideal for printed circuit boards;
◆ Glass Passivated chip junction;
◆ Low profile package;
◆ High Surge current capability;
◆ High case dielectric strength of 2500 VRMS;
◆ Plastic package has Underwrites Laboratory
Flammability Classification 94V-0;
◆ Same footprint V.S GBJ package;
Mechanical Data
◆ Case: GBJL;
Epoxy meets UL-94V-0 Flammability rating;
◆ Terminals:Matte tin plated leads, solderable per
J-STD-002 and JESD22-B102;
E3 suffix for customer grade, meet JESD 201;
◆ High temperature soldering guaranteed:
Solder Dip 270℃,10seconds;
◆ Polarity: As marked on body;
◆ Mounting Torgue: 10cm-kg (8.8inches-lbs) max;
◆ Recommend Torgue:Mounting Torgue:
5.7cm-kg (5inches-lbs);
GBJL35J THRU GBJL35M
Glass Passivated Single-Phase Bridge Rectifier
Reverse Voltage - 600V to 1000V
Forward Current - 35.0 Amperes
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~
~
+
Typical Applications
General purpose use in AC-to-DC bridge full wave rectification for
Switching Power Supply, Home Appliances, Office Equipment,
Industrial Automation applications.
Package Dimensions in mm
Maximum Ratings and Electrical Characteristics
Ratings at 25℃ ambient temperature unless otherwise specified.
Parameter
Symbol GBJL35J GBJL35K GBJL35M Unit
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward
rectified output current at
TC=110℃
TA=25℃
Peak forward surge current 8.3 ms single sine-wave
superimposed on rated load (JEDEC Method)
Rating for fusing (t<8.3ms)
VRRM
VRMS
VDC
IF(AV)
IFSM
I2t
600
420
600
800
560
800
35 (1)
3.8 (2)
450
840
1000
700
1000
V
V
V
Amps
Amps
A2sec
Maximum Instantaneous forward voltage drop per leg at 17.5A VF
1.05
Volt
Maximum DC Reverse Current at Rated
DC Blocking Voltage per leg
Typical thermal resistance per leg
TA=25℃
TA=125℃
Operating junction and Storage Temperature Range
IR
RÓ¨JA
RÓ¨JC
TJ,TSTG
5
150
22 (2)
1.5 (1)
-55 to +150
μA
℃/W
℃
Notes:
1). Unit case mounted on Al plate heatsink;
2). Units mounted on PCB without heatsink;
3). Recommended mounting position is to bolt down on heatsink with silicone thermal compound for maximum heat transfer with #6 screw.