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G954_07 Datasheet, PDF (2/8 Pages) Global Mixed-mode Technology Inc – 2A Low Dropout Regulator
Global Mixed-mode Technology Inc.
G954
Absolute Maximum Ratings
(Note 1)
Input Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7V
Power Dissipation Internally Limited
(Note 2)
Maximum Junction Temperature. . . . . . . . . . . . 150°C
Storage Temperature Range. . . . -65°C ≤TJ ≤ +150°C
Reflow Temperature (soldering, 10sec) . . . . . .260°C
Thermal Resistance Junction to Ambient, (θJA)
TO-263T(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . .80°C/W
Thermal Resistance Junction to Case, (θJc)
TO-263T . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8°C/W
ESD Rating (Human Body Model) . . . . . . . . . . . . 2kV
Operation Conditions
(Note 1)
Input Voltage . . . . . . . . . . . . . . . . . . . . . . . 2.2V ~5.5V
Temperature Range . . . . . . . . . . . .-40°C ≤TA ≤ +85°C
Note (1): See Recommended Minimum Footprint
Electrical Characteristics
VIN = 5V, IO = 0.5A, CIN = COUT = 220µF, TA = TJ = 25°C unless otherwise specified (Note 3)
PARAMETER
Supply Voltage
Output Voltage
Line Regulation
Load Regulation
Quiescent Current
Ripple Rejection
Dropout Voltage
Short Circuit Current
Over Temperature
SYMBOL
VIN
VO
IQ
VD
CONDITION
VIN = VO +0.7V, IO = 10mA
VO+0.7V < VIN < 5.5V, IO = 10mA
G954-12 VIN = 2.5V, 10mA < IOUT < 2A
G954-15 VIN = 2.5V, 10mA < IOUT < 2A
G954-18 VIN = 3.8V, 10mA < IOUT < 2A
G954-25 VIN = 5V, 10mA < IOUT < 2A
VIN = 5V
fi = 120Hz, 1VP-P, IO = 100mA
G954-15 ΔVOUT = 2%, IOUT = 2A
G954-18 ΔVOUT = 2%, IOUT = 2A
G954-25 ΔVOUT = 2%, IOUT = 2A
MIN
2.2
-2
---
TYP
---
VO
0.2
---
1
---
2.7
---
55
---
0.9
---
0.7
---
0.5
---
1
---
150
MAX
5.5
2
2
UNIT
V
%
%
2
%
4.5
mA
---
dB
1.1
0.9
V
0.7
---
A
---
°C
Note 1:
Note2:
Note3:
Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Conditions are
conditions under which the device functions but the specifications might not be guaranteed. For guaranteed specifications
and test conditions see the Electrical Characteristics.
The maximum power dissipation is a function of the maximum junction temperature, TJmax ; total thermal resistance,
θJA, and ambient temperature TA. The maximum allowable power dissipation at any ambient temperature is (Tjmax-TA) /
θJA. If this dissipation is exceeded, the die temperature will rise above 150°C and IC will go into thermal shutdown.
Low duty pulse techniques are used during test to maintain junction temperature as close to ambient as possible.
Ver: 0.9
Apr 24, 2007
TEL: 886-3-5788833
http://www.gmt.com.tw
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