G2998 Datasheet, PDF (1/1 Pages) Global Mixed-mode Technology Inc – DDR Termination Regulator

Global Mixed-mode Technology
G2998/G2999
DDR Termination Regulator
Features
„ Support and DDR I (1.25VTT), DDR II (0.9 VTT) ,
DDR III (0.75 VTT) , and DDR IIIL (0.675VTT)
Requirements
„ Input Voltage Range: 3V to 5.5V
„ VTT_IN Voltage Range: 1.2V to 3.6V
„ Requires Only 20µF Ceramic Output Capacitance
„ VTT Pulled Low by 2kΩ Resistor in Stand-By
Mode (G2998 version)
„ VTT Tri-State in Stand-By Mode
(G2999 version)
„ Integrated Divider Tracks 1/2 VDDQ for Both
VTT and VREF
„ Remote Sensing (VTTS)
„ ±20mV Accuracy for VTT
„ ±30mV Accuracy for VREF
„ Built-In Soft-Start
„ Over Current Protection
„ Thermal Shutdown Protection
„ MSOP-8 and SOP-8(Thermal Pad) Package
low-external component count systems. The G2998/
G2999 maintains a high speed operational amplifier that
provides fast load transient response and only requires
20μF (2 × 10μF) of ceramic output capacitance. The
G2998/G2999 supports remote sensing functions and
all features required to power the DDR I / DDR II / DDR
III / DDR IIIL VTT bus termination according to the
JEDEC specification. In addition, the G2998/ G2999
also has an Enable (EN) pin that provides Suspend to
RAM (STR) functionality. When EN is pulled low, VREF
will remain active, but VTT output will be turned off and
discharged to the ground through internal MOSFETs in
G2998 version and VTT output will be in tri-state in
G2999 version. A power saving advantage can be ob-
tained in this mode through lowering the quiescent cur-
rent to150μA @ VCC=3.3V.
The G2998/G2999 is available in the MSOP-8 and
SOP-8 package with the Thermal pad.
Ordering Information
Applications
„ DDR I/II/III/IIIL Memory Termination
„ SSTL−2, SSTL−18
„ HSTL Termination
General Description
The G2998/G2999 is a 3A sink/source tracking termi-
nation regulator. It is specifically designed for low-cost/
Pin Configuration
ORDER
NUMBER
MARKING
TEMP.
RANGE
G2998P81U
G2998
-40°C~85°C
G2998F11U
G2998
-40°C~85°C
G2999F11U
G2999
-40°C~85°C
Note: P8: MSOP-8 F1: SOP-8 (FD)
1: Bonding Code
U: Tape & Reel
PACKAGE
(Green)
MSOP-8
SOP-8 (FD)
SOP-8 (FD)
G2998
G2998/G2999
GND 1
8 VTT
GND 1
8 VTT
EN 2
VTTS 3
7 VTT_IN EN 2
6 VCC
VTTS 3
T hermal
Pad
7 VTT_IN
6 VCC
VREF 4
5 VDDQ VREF 4
5 VDDQ
MSOP- 8
Top View
SOP- 8 (FD)
Note: Recommend c onnec ting the Thermal Pad
to the GND for excellent power dis sipation.
1 .8V
V CC=3.3V
EN
DDR II
VTT_IN VREF
VDDQ
VCC
VTTS
EN
VTT
G ND
C2
0. 1µ F
C1
2 x 1 0µF
Typical Application Circuit
DDR I
2 .5 V
VC C= 3. 3V
EN
VTT_IN V REF
VDDQ
VCC
VTTS
EN
VTT
GND
C2
0. 1µ F
C1
2 x 10µF
1.5V
V _CC=3.3V
EN
DDR III*
VTT_IN VREF
VDDQ
VCC
VTTS
EN
VTT
G ND
* Recommen ded V_CC =3.3V
C2
0. 1µ F
C1
2 x 1 0µF
Ver: 1.5
Nov 22, 2011
TEL: [phone]
http://www.gmt.com.tw
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