2451ZA Datasheet, PDF (5/8 Pages) Gennum Corporation – Protects one high speed data line

PROTECTION PRODUCTS
Applications Information
Assembly Guidelines
The small size of this device means that some care
must be taken during the mounting process to insure
reliable solder joints. The figure at the right details
Semtech’s recommended aperture based on the
assembly guidelines detailed in the table below. Note
that these are only recommendations and should
serve only as a starting point for design since there
are many factors that affect the assembly process.
Exact manufacturing parameters will require some
experimentation to get the desired solder application.
Assembly Parameter
Solder Stencil Design
Aperture shape
Solder Stencil Thickness
Solder Paste Type
Solder Reflow Profile
PCB Solder Pad Design
PCB Pad Finish
Recommendation
Laser cut, Electro-polished
Rectangular with rounded
corners
0.100 mm (0.004")
Type 4 size sphere or smaller
Per JEDEC J-STD-020
Non-Solder mask defined
OSP OR NiAu
RClamp2451ZA
0.273
0.205
0.220
0.320
Land Pad
Stencil opening
Component
Recommended Mounting Pattern
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