GS9068 Datasheet, PDF (4/8 Pages) Gennum Corporation – SD SDI Cable Driver

2. ELECTRICAL CHARACTERISTICS
2.1 ABSOLUTE MAXIMUM RATINGS
T_A = 25°C unless otherwise indicated
PARAMETER
Supply Voltage
Input ESD Voltage
Storage Temperature Range
Input Voltage Range (any input)
Operating Temperature Range
Power Dissipation
Lead Temperature (soldering, 10 sec)
VALUE
-0.5V to 3.6 V_DC
500V
-50°C < T_s < 125°C
-0.3 to (V_CC +0.3)V
0°C to 70°C
300mW
260°C
CAUTION
The GS9068 is sensitive to electrostatic discharge. Use
extreme caution, observing all ESD-prevention practices,
during handling and assembly. The SDI inputs of the GS9068
must be protected from electrostatic discharge and electrical
overstress during the handling and operation of circuit
assemblies containing the device.
2.2 DC ELECTRICAL CHARACTERISTICS
V_CC = 3.3V, V_EE =0V, T_A = 0°C to 70°C, 270Mb/s unless otherwise shown
PARAMETER
SYMBOL CONDITIONS
MIN
Supply Voltage
Power
Consumption
Supply Current
Output Voltage
Input Voltage
V_CC
3.1
P_D
-
Ι_s
-
V_OC
Common mode
-
V_IC
Common mode
1.6 + ∆V_SDI(DIFF)/2
TYPICAL
3.3
160
48
V_CC - ∆V_SDO(SE)
-
MAX
3.5
-
-
-
V_CC - ∆V_SDI(DIFF)/2
UNITS
V
mW
TEST
LEVEL
3
5
mA
1
mV
6
mV
1
2.3 AC ELECTRICAL CHARACTERISTICS
V_CC = 3.3V, V_EE =0V, T_A = 0°C to 70°C, 270Mb/s unless otherwise shown
PARAMETER
SYMBOL
CONDITIONS
Serial input data rate
Input Voltage Swing
DR_SDI
∆V_SDI(DIFF)
Differential
Output Voltage Swing
∆V_SDO(SE)
Single Ended into 75Ω external
load
R_SET = 750Ω
Additive jitter
Rise/Fall time
Mismatch in rise/fall time
t_r, t_f
∆t_r, ∆t_f
20% - 80%
Duty cycle distortion
Overshoot
Output Return Loss
ORL
TEST LEVELS
1. Production test at room temperature and nominal supply voltage with
guardbands for supply and temperature ranges.
2. Production test at room temperature and nominal supply voltage with
guardbands for supply and temperature ranges using correlated test.
3. Production test at room temperature and nominal supply voltage.
4. QA sample test.
5. Calculated result based on Level 1, 2, or 3.
6. Not tested. Guaranteed by design simulations.
7. Not tested. Based on characterization of nominal parts.
8. Not tested. Based on existing design/characterization data of similar
product.
9. Indirect test.
10. Wafer Probe
MIN TYPCAL MAX
UNITS
TEST
LEVEL
-
-
540
Mb/s
1
300
-
2000
mV_p-p
1
750
800
850
mV_p-p
1
-
-
30
ps
1
400
-
800
ps
1
-
-
30
ps
1
-
-
100
ps
1
-
-
8
%
1
15
-
-
dB
7
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