3346P Datasheet, PDF (3/9 Pages) Gennum Corporation – Low ESD clamping voltage

PROTECTION PRODUCTS
Typical Characteristics
Clamping Voltage vs. Peak Pulse Current
(Between any I/O and Ground)
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
0
Waveform
Parameters:
tr = 8µs
td = 20µs
1
2
3
4
5
Peak Pulse Current - I_PP (A)
ESD Clamping (+8kV Contact per IEC 61000-4-2)
(Between any I/O and Ground)
90
80
70
60
50
40
30
20
10
0
-10
-10
0
Measured with 50 Ohm scope input
impedance, 2GHz bandwidth. Corrected
for 50 Ohm, 20dB attenuator. ESD gun
return path connected to ESD ground
plane.
10
20
30
40
50
60
70
80
Time (ns)
TLP Characteristic (Positive)
30
Transmission Line Pulse Test (TLP)
Settings:
25
t_p=100ns, t_r=0.2ns,
I_TLP and V_TLP averaging window:
t₁=70ns to t₂=90ns
20
15
10
5
0
0
2
4
6
8
10
Clamping Voltage (V)
RClamp3346P
PRELIMINARY
Junction Capacitance vs. Reverse Voltage
(Between any I/O and Ground)
1.00
0.90
0.80
0.70
0.60
0.50
0.40
0.30
0.20
0.10
f = 1 MHz
T=25^oC
0.00
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
Reverse Voltage - V_R (V)
ESD Clamping (-8kV Contact per IEC 61000-4-2)
(Between any I/O and Ground)
10
0
-10
-20
-30
-40
-50
-60
-70
-80
-10 0
Measured with 50 Ohm scope input
impedance, 2GHz bandwidth. Corrected
for 50 Ohm, 20dB attenuator. ESD gun
return path connected to ESD ground
plane.
10 20 30 40 50 60 70 80
Time (ns)
TLP Characteristic (Negative)
0
Transmission Line Pulse Test (TLP)
Settings:
-5
t_p=100ns, t_r=0.2ns,
I_TLP and V_TLP averaging window:
t₁=70ns to t₂=90ns
-10
-15
-20
-25
-30
-10
-8
-6
-4
-2
0
Clamping Voltage (V)
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3
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